ANSYS Simulation World is an annual conference hosted by ANSYS, Inc., a leading provider of engineering simulation software. The event typically brings together engineers, designers, researchers, and industry experts from around the world to discuss the latest advancements, best practices, and case studies in engineering… Read More
We have been working with Ansys since SemiWiki was founded in 2011. It has been a richly rewarding relationship in all regards. I always say the semiconductor industry is filled with the most intelligent people in the world and Ansys is an excellent proof point. I have known John Lee for 30+ years and he is one of my trusted few, absolutely.… Read More
In the realm of engineering simulations, the demand for faster, more accurate solutions to complex multiphysics challenges is ever-growing.
Simulation is a vital tool for engineers to design, test, and optimize complex systems and products. It helps engineers reduce costs, improve quality, and accelerate innovation. However,… Read More
In the dynamic realm of technological innovation, collaborations and partnerships often serve as catalysts for groundbreaking advancements. Continuing along this trajectory, Ansys, a global leader in engineering simulation software, has forged a partnership with Intel Foundry to enable multiphysics chip design. The … Read More
Mergers and acquisitions have been a big part of EDA since the beginning. We keep an EDA/IP Mergers and Acquisitions Wiki, it is 13 years old now and has more than one million views. Personally, I have been involved with dozens of acquisitions over my 40 year career, some good, some bad, all are interesting and are an important part … Read More
Understanding the electromagnetic (EM) coupling between various elements of a high-frequency semiconductor device is vital for meeting design specifications and ensuring reliable operation in the field. These EM interactions include not only the silicon chip but also extend to the package that encloses it. However, it may… Read More
As we all know, hearing directly from the people who actually use EDA tools, people who are solving real world problems with the latest technologies are the best source of information. Thus EDA User group meetings are always first on my event list every year which brings us to Ansys Ideas.
As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More
Dan is joined by William Ruby, director of product management for Synopsys Power Analysis products. He has extensive experience in the area of low-power IC design and design methodology, and has held senior engineering and product marketing positions with Cadence, ANSYS, Intel, and Siemens. He also has a patent in high-speed… Read More
