Ansys ASEAN Semiconductor Virtual Summit 2025

Ansys ASEAN Semiconductor Virtual Summit 2025
by Admin on 05-05-2025 at 7:51 pm

Join the Ansys ASEAN Semiconductor Virtual Summit 2025 to explore the latest in semiconductor design, industry best practices, enhancing your skills, and shape the future of technology. Don’t miss it!

DATE/TIME:
May 15, 2025
2:30 PM SGT (Singapore Time), 1:30 PM ICT (Vietnam Time)

Venue:
Virtual

Overview

Join us for the Ansys

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Webinar: Communications System Design and Space Environment Effects

Webinar: Communications System Design and Space Environment Effects
by Admin on 05-05-2025 at 7:47 pm

This webinar covers satellite communications, starting from a ground station link and advancing to digital engineering techniques, including phased arrays, interference, and space environment factors. In addition, it explores Space Environmental Effects including Solar Array ESD, Radiation Hardening and RFI of Rocket

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Webinar: Transforming Robot Arm Design with Topology Optimization

Webinar: Transforming Robot Arm Design with Topology Optimization
by Admin on 05-05-2025 at 7:45 pm

This webinar aims to explore innovative design approaches using the power of GPU technology combined with an intuitive interface, effectively democratizing topology optimization.

Date / Time:
May 7, 2025
11 AM EDT

Venue:
Virtual

Overview

As robot arms become increasingly crucial for efficient and effective production, staying

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Webinar: Eliminating Vibrations: Optimizing Mass Dampers with Simulation and Testing

Webinar: Eliminating Vibrations: Optimizing Mass Dampers with Simulation and Testing
by Admin on 05-05-2025 at 7:43 pm

Discover how cutting-edge transient structural analysis and experimental testing can solve even the toughest challenges in this upcoming presentation.

DATE / TIME:
May 8, 2025
10 AM EDT / 4 PM CEST / 7:30 PM IST

Venue:
Virtual

Overview

This webinar will showcase how transient structural analysis and experimental testing optimized

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Intel Foundry Delivers!

Intel Foundry Delivers!
by Daniel Nenni on 05-05-2025 at 10:00 am

Intel Foundry Direct Connect Hall 4 1024x576

Now that the dust has settled, I will give you my take on the Intel Foundry event. Some might call me a semiconductor event critic as I have attended hundreds of them over the last 40 years starting with the Design Automation Conference in 1984. Foundry events are my favorite because they really are the pulse of the semiconductor industry,… Read More


Webinar: Transform Antenna Teaching with Python: A Quick Start to PyAEDT

Webinar: Transform Antenna Teaching with Python: A Quick Start to PyAEDT
by Admin on 01-20-2025 at 10:57 pm

Learn to teach antenna design effectively with PyAEDT. This webinar covers scripting, HFSS, Maxwell, Icepak examples, and advanced simulations for professors.

TIME:
05/14/2025
11 AM EDT

Venue:
Virtual

Overview

Today’s engineering practice requires skills in scripting, finite element analysis of designs, and a combination

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Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters

Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters
by Daniel Nenni on 11-06-2024 at 10:00 am

banner for webinar

The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed.… Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


Ansys and eShard Sign Agreement to Deliver Comprehensive Hardware Security Solution for Semiconductor Products

Ansys and eShard Sign Agreement to Deliver Comprehensive Hardware Security Solution for Semiconductor Products
by Marc Swinnen on 09-12-2024 at 10:00 am

Probing

Integrated circuits, or chips, lie at the heart of today’s electronic systems that are mission critical for almost every sector of the economy – from healthcare, to banking, military equipment, cars, planes, telecommunications, and the internet itself. The data flowing through these systems is the lifeblood of modern… Read More