Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative MattersThe future of work will not be shaped…Read More
Foundation IP for Intel 18A: Technical Overview and Why It MattersSynopsys Foundation IP for Intel 18A is a…Read More
WEBINAR: Defacto is Boosting Front-end SoC Design With AI-Powered EDA toolsThe real promise of AI in EDA is…Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too LateChip-level vulnerability is becoming an existential threat for…Read More
Why Real-Time Intelligence is the Next Differentiator in Semiconductor TestEven with advances in AI, automation, and advanced…Read More
There is an interesting discussion on the LinkedIn SoC Power Integrity Group in regards to the power integrity challenges for high speed and high frequency designs. More specifically, the additional attention an on-chip power delivery network (PDN) requires as the operating frequency of ICs and SoCs increases.
The PDN has to… Read More
At advanced process nodes, variation and its effects on the design become a huge challenge. Join Cadence® Virtuoso® experts for a series of technical webinars on variation-aware design. Learn how to use advanced technologies and tools to analyze and understand the affects of variation. We’ll introduce you to the latest Virtuoso… Read More
Silicon Creations will be presenting a paper with Berkeley Design Automation at the TSMC Open Innovation Platform (OIP) Ecosystem Forum next week where TSMC’s design ecosystem member companies and customers share real-case solutions for design challenges within TSMC’s design ecosystem:
This presentation will describe … Read More
A year ago, Meg Whitman decided it was time to venture back into the business world by grabbing onto the HP CEO baton from a badly wounded Leo Apotheker. What for? My best guess is to enter the Pantheon of Great Turnaround CEOs of failing companies, best exemplified by the work of Lou Gerstner with IBM in the early 1990s. It comes too late… Read More
Altera have been making use of Synopsys’s virtual platform technology to accelerate the time to volume by letting software development proceed in parallel with semiconductor development so that the software development does not need to wait until availability of hardware.
In the past, creating the virtual platform … Read More
I recently read a news article where the author referred to Moore’s Law as a ‘Law of Science discovered by an Intel engineer’. Readers of SemiWiki would call that Dilbertesque. Gordon Moore was Director of R&D at Fairchild Semiconductor in 1965 when he published his now-famous paper on integrated electronic… Read More
At the Linley processor conference this week, Chris Rowen, the CTO of Tensilica presented on the protocol processing dataplane. That sounds superficially like he is talking about networking but in fact true protocol processing is just part of adding powerful compute features to the dataplane. Other applications are video, … Read More
I was at the Linley Processor Conference yesterday. There are two of these each year, one focused on mobile and this one, focused on networking and communications (so routers, base-stations and the like). You probably know that ARM is pretty dominant in mobile handsets (and Intel is trying to get a toe-hold although I’m skeptical… Read More
Qualcomm VP of Engineering, Charlie Matar, will be keynoting the Apache/ANSYS seminar in Santa Clara next Thursday. Charlie is a great guy and a great speaker so you won’t want to miss this and it’s FREE! I spoke to Charlie, he will be speaking on:
Today’s complex SOC design is driven by the constant demand for high performance… Read More
The recent (August) flash memory summit in Santa Clara had a session devoted to ReRAM as well as featuring prominently in the keynote address by Sung Wook Park of SK Hynix. The talk includes a summary of NAND’s well known scaling issues along with approaches to 3D NAND. It turns out that they are working on three different technologies:… Read More
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The Packaging PDK Is the Missing Layer for Co-Packaged Optics