Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion… Read More
Nvidia Sees AGI While OpenAI Sees DangerJensen Huang’s declaration that “AGI has arrived” is…Read More
Samsung Might Be the Most Unusual Company on EarthSamsung might be the most unusual company on…Read More
TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of ChipsIt’s that time of year again. Time certainly…Read More
PDF Solutions CONNECT 2026: Where Semiconductor Data Meets AIThe semiconductor industry is entering a period in…Read MoreExecutive Interview with Raghu Belur, Co-Founder of Enphase Energy
Raghu co-founded Enphase Energy with Martin Fornage in 2006. He has more than 25 years of experience in the clean energy and high‑technology industries, and has been at the forefront of developing Enphase’s leading integrated energy system—with solar generation, storage, monitoring, and control. Prior to Enphase, Raghu developed
Podcast EP367: How Keysight is Accelerating RF and Microwave Design with Matthew Ozalas
Daniel is joined by Matthew Ozalas from Keysight. With an experience of more than 20 years, Matthew brings a plethora of knowledge in complex RF designs using CAD tools. Matthew has also authored several application notes on RF and Microwave design and development using Keysight ADS with his recent ones based on “Artificial … Read More
TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders
TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More
CEO Interview with Charlie Cheng of CEO of TeRAM
Charlie Cheng is CEO of TeRAM, with four decades of technology experience focused on microprocessor architecture and semiconductor memory. Before TeRAM, he worked on several AI processors, including multiple generations of Meta’s MTIA accelerators beginning in 2019. Previously, he served as CEO of Kilopass, a semiconductor… Read More
The Invisible Bottleneck Is Costing You Time You Can’t Get Back
By Joel Jorgensen, FlowAccel.
The 2026 Siemens EDA and Wilson Research Group study just came out. Verification now eats close to half the schedule on every IC and FPGA program. I don’t doubt that number. What I don’t know is how much of it is actually verification, and how much of it is something else showing up disguised… Read More
ASML Has High-NA and Chipmakers Can’t Say No
ASML’s grip on the most advanced corner of chip manufacturing is tightening. The Dutch company, already the sole supplier of extreme ultraviolet lithography systems, is winning broader industry support for High Numerical Aperture EUV, or High NA, its next-generation technology for printing smaller and denser circuitry.… Read More
Podcast EP366: How Cognichip is Changing Chip Design with Faraj Aalaei
Daniel is joined by the CEO of Cognichip, Faraj Aalaei, a successful visionary entrepreneur with over 40 years of distinguished experience in communications and networking technologies. As a leading entrepreneur in Silicon Valley, he was responsible for building and leading two semiconductor companies through IPOs as a founder… Read More
Arm targets the agentic AI era with new edge, cloud and robotics platforms
Arm is expanding its computing platform for an era in which artificial intelligence does more than respond to individual prompts. The company expects AI agents to operate continuously across phones, data centers, vehicles, robots and other physical systems—perceiving their surroundings, reasoning about objectives and … Read More
Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AI
Instead of tweaking existing designs, VSORA built an AI chip from scratch to fix the real bottleneck: moving data fast enough to keep the math circuits busy.
There’s a version of the AI hardware story that everyone in the chip industry has heard a hundred times. A startup raises money on a clever chip design, promises to topple… Read More


The Invisible Bottleneck Is Costing You Time You Can’t Get Back