SILVACO 051525 Webinar 800x100 v2

Metal fill extraction: Breaking the speed-accuracy tradeoff

Metal fill extraction: Breaking the speed-accuracy tradeoff
by Admin on 05-12-2025 at 10:00 am

fig1 metal fill

As semiconductor technology scales and device complexity increases, accurately modeling the parasitic effects of metal fill has become critical for circuit performance, power integrity, and reliability. Metal fill is a crucial part of the manufacturing process, ensuring uniform layer density, improving planarization,… Read More


How Arteris is Revolutionizing SoC Design with Smart NoC IP

How Arteris is Revolutionizing SoC Design with Smart NoC IP
by Mike Gianfagna on 05-12-2025 at 6:00 am

How Arteris is Revolutionizing SoC Design with Smart NoC IP

Recently, Design & Reuse held its IP-SoC Days event at the Hyatt Regency in Santa Clara. Advanced IP drives a lot of the innovation we are seeing in chip design. This event provides a venue for IP providers to highlight the latest products and services and share a vision of the future. IP consumers are anxious to hear about all the… Read More


CEO Interview with Ido Bukspan of Pliops

CEO Interview with Ido Bukspan of Pliops
by Daniel Nenni on 05-11-2025 at 4:00 pm

Ido Bukspan

Prior to becoming CEO of Pliops in 2023, Ido Bukspan was the senior vice president of the Chip Design Group at NVIDIA and one of the leaders at Mellanox before it was acquired by NVIDIA for nearly $7 billion.

Tell us about your company.

Pliops accelerates and amplifies the performance and scalability of global GenAI infrastructure,… Read More


CEO Interview with Roger Cummings of PEAK:AIO

CEO Interview with Roger Cummings of PEAK:AIO
by Daniel Nenni on 05-11-2025 at 2:00 pm

Roger Cummings of PEAK AIO

Roger Cummings is the CEO of PEAK:AIO, a company at the forefront of enabling enterprise organizations to scale, govern, and secure their AI and HPC applications. Under Roger’s leadership, PEAK:AIO has increased its traction and market presence in delivering cutting-edge software-defined data solutions that transform commodity… Read More


Video EP4: A Deeper Look at Advanced Packaging & Multi-Die Design Challenges with Anna Fontanelli

Video EP4: A Deeper Look at Advanced Packaging & Multi-Die Design Challenges with Anna Fontanelli
by Daniel Nenni on 05-09-2025 at 10:00 am

In this episode of the Semiconductor Insiders video series, Dan is once again joined by Anna Fontanelli, founder and CEO of MZ Technologies. In this discussion, more details of the challenges presented by advanced packaging and multi-die design are explored. Anna provides details of what’s involved in architectural … Read More


Analog Bits Steals the Show with Working IP on TSMC 3nm and 2nm and a New Design Strategy

Analog Bits Steals the Show with Working IP on TSMC 3nm and 2nm and a New Design Strategy
by Mike Gianfagna on 05-09-2025 at 8:00 am

Analog Bits Steals the Show with Working IP on TSMC 3nm and 2nm and a New Design Strategy

The TSMC Technology Symposium recently kicked off in Santa Clara, with a series of events scheduled around the world. This event showcases the latest TSMC technology. It is also an opportunity for TSMC’s vast ecosystem to demonstrate commercial application on TSMC’s technology. There is a lot to unpack at an event like this. There… Read More


Podcast EP286: The Significant Impact of Ambient Scientific Technology on AI Deployment with GP Singh

Podcast EP286: The Significant Impact of Ambient Scientific Technology on AI Deployment with GP Singh
by Daniel Nenni on 05-09-2025 at 6:00 am

Dan is joined by GP Singh, CEO of Ambient Scientific. With over 20 years of experience, GP has played a pivotal role in shaping the industry, driving 50+ chip tapeouts, including game-changing advancements at FinFET technology nodes. Now, as the CEO of Ambient Scientific, GP brings together hands-on engineering expertise and… Read More


RISC-V Virtualization and the Complexity of MMUs

RISC-V Virtualization and the Complexity of MMUs
by Bernard Murphy on 05-08-2025 at 7:00 am

Virtual memory mapping

In the early days of RISC-V adoption, applications were microcontroller-centric with no need for virtualization support. But horizons expanded and now RISC-V is appearing in application processors, very much needing to be able to virtualize multiple apps concurrently. Take another step forward to datacenter servers running… Read More


Beyond the Memory Wall: Unleashing Bandwidth and Crushing Latency

Beyond the Memory Wall: Unleashing Bandwidth and Crushing Latency
by Lauro Rizzatti on 05-07-2025 at 2:00 pm

Figure 1

VSORA AI Processor Raises $46 Million to Fast-Track Silicon Development

We stand on the cusp of an era defined by ubiquitous intelligence—a stone’s throw from a tidal wave of AI-powered products underpinned by next-generation silicon. Realizing that future demands nothing less than a fundamental rethink of how we design semiconductors… Read More


Intel’s Foundry Transformation: Technology, Culture, and Collaboration

Intel’s Foundry Transformation: Technology, Culture, and Collaboration
by Kalar Rajendiran on 05-07-2025 at 10:00 am

Intel and UMC 2025

Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More