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New Audio SoCs Combine Bluetooth HDT with Dual-RF Technology

New Audio SoCs Combine Bluetooth HDT with Dual-RF Technology
by Daniel Nenni on 08-06-2026 at 2:00 pm

Next generation Bluetooth audio ecosystem

Ceva and Actions Technology have expanded their longstanding partnership with the introduction of the ATS296X series, a new family of Bluetooth audio chips designed to bring High Data Throughput technology into commercial wireless products. Powered by the Ceva-Waves Bluetooth HDT platform, the series is positioned as one… Read More


White Paper: The Semiconductor Foundation of Modern AI Data Centers

White Paper: The Semiconductor Foundation of Modern AI Data Centers
by Daniel Nenni on 08-06-2026 at 10:00 am

The Semiconductor Foundation of Modern AI Data Centers

Artificial intelligence AI has become one of the most significant drivers of semiconductor innovation in history. While AI applications often receive the most attention, the underlying hardware infrastructure that enables AI consists of a highly sophisticated ecosystem of semiconductor technologies. Modern AI data centers… Read More


Mach42 Delivers a Different Take on AI in the Design Flow at DAC 2026

Mach42 Delivers a Different Take on AI in the Design Flow at DAC 2026
by Mike Gianfagna on 08-06-2026 at 6:00 am

Mach42 Delivers a Different Take on AI in the Design Flow at DAC 2026

I believe DAC 2026 will be remembered as the turning point for AI assisted design. There has been discussion about AI infusion in EDA for a while now. Most of it was about how AI can be added to traditional tools to make existing methodologies better. This year, that changed. There were several new companies that highlighted a fundamentally… Read More


The AI Genie Is Out of the Bottle and Won’t Go Back

The AI Genie Is Out of the Bottle and Won’t Go Back
by Jonah McLeod on 08-05-2026 at 2:00 pm

Genie out of Bottle Final

This week, Meta became the fourth major AI lab in two weeks to disclose that one of its own models breached another company’s systems during a security test. The company says a misconfiguration by an outside evaluator handed its Muse Spark 1.1 model internet access it wasn’t supposed to have — an accident in the test Read More


McClean Report June 2026: Q2 Semiconductor Market Forecast Update

McClean Report June 2026: Q2 Semiconductor Market Forecast Update
by Daniel Nenni on 08-05-2026 at 10:00 am

McClean Report June 2026 Q2 Semiconductor Market Forecast Update

The semiconductor industry is entering an extraordinary growth phase, driven primarily by artificial intelligence infrastructure and the severe supply constraints surrounding advanced logic and memory devices. According to the McClean Report’s June 2026 update, the global semiconductor market is forecast to grow 98.3%… Read More


Imec Unlocks System-Level III-V Chiplet Integration on Si-CMOS with Advanced 300mm RF Silicon Interposer Platform

Imec Unlocks System-Level III-V Chiplet Integration on Si-CMOS with Advanced 300mm RF Silicon Interposer Platform
by Daniel Nenni on 08-05-2026 at 6:00 am

Imec Unlocks System Level III V Chiplet Integration on Si CMOS

As wireless communication systems evolve toward 6G, satellite connectivity, advanced radar, and high-performance sensing applications, the integration of heterogeneous semiconductor technologies has become a critical challenge. Silicon CMOS remains the dominant platform for digital processing and system control,… Read More


DAC 2026: Accellera Luncheon Panel on Embracing AI for Advanced Design and Verification

DAC 2026: Accellera Luncheon Panel on Embracing AI for Advanced Design and Verification
by Mike Gianfagna on 08-04-2026 at 2:00 pm

DAC 2026 Accellera Luncheon Panel on Embracing AI for Advanced Design and Verification

AI was a hot topic at DAC this year. If you attended the event, you’ve already heard about many new tools and systems that aim to improve time to market and quality for advanced semiconductors and systems. I had the pleasure of chairing an Accellera sponsored luncheon panel on Tuesday at DAC that took a different view of AI.

As AI and … Read More


Shift Left with S2C Prodigy: From RTL Verification to Real-World Software Validation

Shift Left with S2C Prodigy: From RTL Verification to Real-World Software Validation
by Daniel Nenni on 08-04-2026 at 10:00 am

HAV

For modern SoC teams, “shift left” no longer means finding a few more RTL bugs before tape-out. It means moving meaningful system validation earlier—far enough left that firmware, operating systems, drivers, applications, and external interfaces can be exercised before first silicon arrives. This change is essential as software… Read More


How SOCAMM2 Could Reshape Server Memory for AI

How SOCAMM2 Could Reshape Server Memory for AI
by Daniel Nenni on 08-04-2026 at 6:00 am

Rambus SOCAMM2

As artificial intelligence systems become larger and more demanding, memory is becoming one of the most important constraints in server design. Modern AI workloads do not only require powerful GPUs and accelerators; they also require enormous amounts of data to move quickly and efficiently between memory and compute engines.… Read More


Executive Interview with James Huang of AlChip

Executive Interview with James Huang of AlChip
by Daniel Nenni on 08-03-2026 at 2:00 pm

James Huang

I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.

James is acknowledged as a leading light in advanced node ASICs, based… Read More