Large design enterprises have multiple concurrent activities around IP of various types: software/firmware, blocks defined in RTL or HLS, verification IPs of multiple different types, physical implementations, scripts/files for timing, power management, etc., etc. Each of these continues to evolve and branch to serve … Read More
Why Huawei Says It Will Match TSMC's Most Advanced Chips by 2031Huawei’s assertion that it could match TSMC in…Read More
Enhancing Multi-Domain System Simulation with FMI Co-SimulationAs systems become increasingly complex across every field…Read More
Ceva Targets PC Gaming Audio Market With RealSpace Elevate for WindowsCeva has launched RealSpace™ Elevate for Windows, a…Read More
Applying QED to Hardware Accelerator Verification. Innovation in VerificationQED (Quick Error Detection) can be a powerful…Read MoreSee Autonomous Chip Design in Action with ChipAgents at DAC 2026
Making the AI wave at DAC 2026 in Long Beach
DAC comes to Long Beach for the first time in 2026, with artificial intelligence expected to be one of the central topics across the conference program and exhibition floor.
For semiconductor design and verification teams, the discussion has moved beyond whether AI can assist engineers.… Read More
The Packaging PDK Is the Missing Layer for Co-Packaged Optics
From Photonic Device Design to Electro-Optical Realization
Co-packaged optics will not scale through photonic device performance alone.
As AI infrastructure pushes bandwidth, power, latency, and reach to new limits, optics is moving closer to the compute engine. The industry is no longer asking only whether a photonic device… Read More
Demonstrating the EasyAI ECO Suite – An AI-Powered Functional ECO Solution at DAC 2026
Easy-Logic, a leading provider of high-performance Engineering Change Order (ECO) solutions in Electronic Design Automation (EDA), will showcase its latest innovation — the EasyAI ECO Suite — at DAC in Los Angeles, July 27–29, 2026. This intelligent ECO solution integrates AI engines into the entire ECO workflow and systematically… Read More
The Accidental Infrastructure: How Crypto Miners Built the Foundation of the AI Boom
Most crypto forty-niners died broke in a warehouse full of their computing rigs. Former Ethereum miner CoreWeave took its gold to Wall Street. On June 22, 2026, it joined the Nasdaq-100 — fifteen months after its IPO, nine years after its founders assembled their first GPU rig in a New Jersey office.
The people who built the physical… Read More
From Detection to Safety: Reframing Fault Simulation for Functional Safety
In the early 1980s, when computer-aided engineering (CAE), the precursor to modern electronic design automation (EDA), was just taking shape, my professional trajectory shifted in a way that would prove foundational. I joined Teradyne, the Boston-based leader in automated test equipment (ATE), and I encountered for the first… Read More
Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog
Chris Morrison is VP Product Marketing at Agile Analog, the customizable analog IP company. He has over 18 years’ experience of developing strong relationships with key partners across the semiconductor industry and delivering innovative analog, digital, power management and audio products, working for international companies… Read More
CEO Interview with Brice Cruchon, CEO of Dracula Technologies
Brice Cruchon is the Founder and CEO of Dracula Technologies, a company he established in 2011 to develop and industrialize organic photovoltaic (OPV) technologies for indoor energy harvesting. He holds a Master’s degree in Chemistry from the University of Nantes (France) and has built a career spanning chemistry, intellectual… Read More
Executive Interview with Genta Taniguchi of Kyocera
Genta Taniguchi serves as Executive Officer and Head of the Corporate Ceramic Materials Semiconductor Components Group at Kyocera Corporation. He leads initiatives in advanced ceramics and semiconductor-related technologies, supporting the company’s global business in electronic and communication components.
With… Read More
Podcast EP353: What Real-Time Visibility Is and Why it Matters with yieldHUB’s John O’Donnell
Daniel is joined by John O’Donnell, Founder and CEO of yieldHUB, a pioneering leader in advanced data analytics for the semiconductor industry. Since establishing the company in 2005 he has transformed it from a two-person startup into a trusted multinational partner that empowers some of the world’s leading semiconductor … Read More



The Packaging PDK Is the Missing Layer for Co-Packaged Optics