Semiconductor manufacturing has always depended on precise measurement. As devices become more complex and packaging integrates more components, however, measuring individual process steps is no longer enough. Manufacturers need to understand how decisions across fabrication, assembly, and test affect the finished … Read More
Inside the Silicon: Analog Bits N2P2 Test ChipThe future of intelligent computing depends on silicon…Read More
WEBINAR: Cut down EDA License cost by 25% with Stratos AI NitroExpensive EDA licenses should keep chip design moving.…Read More
From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation Applied Materials President and…Read MoreThe Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate Up
Most of the AI conversation stops at the chip. At SEMICON West 2026 I sat down with René Jonker, Chief Product Officer of Soitec, to talk about what sits underneath it.
Ask an engineer where AI performance comes from and you will hear about process nodes, dataflow, HBM stacks and interconnect fabrics. Rarely about the wafer. Yet a … Read More
When Nanomagnets Do the Math: France’s New Machine for Impossible Choices
French researchers have demonstrated a hybrid nanoelectronic “Ising machine” designed to solve difficult combinatorial optimization problems more efficiently. The experimental system combines two emerging device technologies—resistive memory and spintronics—to perform parts of an optimization algorithm through… Read More
Ceva’s Next-Generation NeuPro Brings a Unified AI Platform from Sensors to Infrastructure
Ceva is expanding the reach of its neural processing technology with a next-generation NeuPro portfolio designed to serve everything from always-on sensors to AI infrastructure. The announcement introduces four NPU families sharing a common architecture and unified software stack, giving semiconductor developers a consistent… Read More
ChipAgents Expands AI Across Chip Design. The Test Is Faster, Verified Results
ChipAgents is expanding its agentic AI platform across digital and analog semiconductor engineering, aiming to connect fragmented design workflows through a common system that can plan tasks, operate engineering tools and evaluate results.
The Santa Clara company says its IC-Star engine combines organizational design … Read More
Why Synopsys’ Role in AMD’s Instinct MI455X Matters for AI Infrastructure
Synopsys’ collaboration with AMD on the Instinct MI455X GPU highlights a shift in how advanced AI processors are developed. Increasing performance depends on coordinating compute dies, memory interfaces, packaging, power delivery, and software. According to Synopsys’ announcement, AMD used its design, verification, … Read More
S2C Targets Faster RISC-V Bring-Up With Prototyping and AI
S2C showcased FPGA prototyping and AI-assisted debugging at the sixth RISC-V Summit China, outlining how developers can validate complex processor designs and begin software development before first silicon. Its demonstrations connected three stages of that effort: running substantial RISC-V systems on FPGA hardware,… Read More
Accellera’s FSL 1.0 Gives Functional Safety Data a Common Language
Accellera Systems Initiative has approved Functional Safety Language Standard 1.0 for release, addressing a persistent challenge in semiconductor development: moving safety information reliably between tools, engineering teams, and companies. Announced October 21, the standard establishes a common language and data… Read More
Inside the Package Powering Modern AI
TSMC’s CoWoS-S is critical to the artificial intelligence era because it solves the central systems problem facing modern accelerators: computing capability is growing faster than conventional packages can supply data, power, and connectivity. CoWoS-S, meaning Chip-on-Wafer-on-Substrate with a silicon interposer, … Read More
SEMICON West 2026: After the Toast, the Hard Questions
Champagne is an unusual opening act for a semiconductor conference. At SEMICON West 2026, October 13 to 15, at the Moscone Center in San Francisco, it served a purpose. The toast marked an industry that has already crossed $1 trillion in annual revenue, almost four years ahead of earlier projections.
WSTS (World Semiconductor … Read More




Why America’s Semiconductor Manufacturing Capacity Matters