The Chiplet Summit recently concluded. Multi-die heterogeneous design is a hot topic these days and chiplets are a key enabler for this trend. The conference was noticeably larger this year. There were many presentations and exhibits that focused on areas such as how to design chiplets, what standards are important, how to integrate… Read More
Advanced Architectures for Hybrid III-V/Silicon Quantum Cascade LasersMid-infrared (MIR) photonic integrated circuits are emerging as…Read More
Efficient Bump and TSV Planning for Multi-Die Chip DesignsThe semiconductor industry has experienced rapid advancements in…Read More
The Evolution of RISC-V and the Role of Andes Technology in Building a Global EcosystemDuring my frequent trips to Taiwan as a…Read More
Capability Hardware Enhanced RISC Instructions CHERI AllianceThe CHERI Alliance is a non-profit organization dedicated…Read MoreIntel Foundry: How They Got Here and Scenarios for Improvement
How do you get a shortage while not growing???
Intel Announced earnings in January. Then David Zinsner presented updates on business this week. David is open when talking and always shares 2-3 things he probably should not share. Often he shares things some of us know, but we cannot present because it is not public. Then he makes it… Read More
The Next Hurdle AI Systems Must Clear
AI isn’t having an easy ride. The media and Wall Street swing wildly between extremes on any hint of a shift in AI sentiment. Dickens saw this coming: “It was the best of times, it was the worst of times, it was the age of wisdom, it was the age of foolishness, it was the epoch of belief, it was the epoch of incredulity, it was the season of … Read More
Why Your LLM-Generated Testbench Compiles But Doesn’t Verify: The Verification Gap Problem
By Vikash Kumar, Senior Verification Architect | Arm | IEEE Senior Member.
The Problem Every Verification Engineer Recognizes
You ask an LLM to generate a UVM testbench. It produces 25 files. Everything compiles. You run the simulation — and nothing happens. The scoreboard reports zero checks. The slave driver stops after 10… Read More
Advanced Architectures for Hybrid III-V/Silicon Quantum Cascade Lasers
Mid-infrared (MIR) photonic integrated circuits are emerging as a key technology for applications ranging from environmental monitoring and medical diagnostics to defense and industrial process control. The MIR spectral region, often referred to as the molecular “fingerprint” region, exhibits strong absorption features… Read More
Efficient Bump and TSV Planning for Multi-Die Chip Designs
The semiconductor industry has experienced rapid advancements in recent years, particularly with the increasing demand for high-performance computing, artificial intelligence, and advanced automotive systems. Traditional single-die chip designs are often unable to meet modern PPA requirements. As a result, engineers… Read More
The Evolution of RISC-V and the Role of Andes Technology in Building a Global Ecosystem
During my frequent trips to Taiwan as a foundry relationship professional I remember meeting Frankwell Lin, CEO of Andes, in Taiwan 15+ years ago. As I walked to TSMC HQ from the Hotel Royal (my second home for many years) Andes was about mid point and Frankwell’s door was always open. Sometimes just tea, sometimes technology,… Read More
Capability Hardware Enhanced RISC Instructions CHERI Alliance
The CHERI Alliance is a non-profit organization dedicated to accelerating the global adoption of CHERI (Capability Hardware Enhanced RISC Instructions), a technology designed to improve computer security at the hardware level. Established as an independent entity, the Alliance brings together industry leaders, researchers,… Read More
Operationalizing Secure Semiconductor Collaboration: Safely, Globally, and at Scale
Semiconductor manufacturing is among the most complex industrial activities in existence. As device geometries shrink and systems become more interconnected, software has become as critical as process technology itself. Modern fabs depend on extensive automation, real-time analytics, and deep integration between tools,… Read More
Keynote: On-Package Chiplet Innovations with UCIe
In the rapidly evolving landscape of semiconductor technology, the Universal Chiplet Interconnect Express (UCIe) emerges as a groundbreaking open standard designed to revolutionize on-package chiplet integrations. Presented by Dr. Debendra Das Sharma, Chair of the UCIe Consortium and Intel Senior Fellow, at the Chiplet… Read More



Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment