Atrenta is having a special offer to let you “spring clean” your IP for free. They are providing two weeks of free access to the Atrenta IP kit starting from today, April 16th, until the end of May. During this period, qualified design groups in the US will be able to use the kit for two consecutive weeks to “spring… Read More
High Yield and Performance – How to Assure?
In today’s era, high performance mobile devices are asserting their place in every gizmos we play with and guess what enables them work efficiently behind the scene – it’s large chunks of memory with low power and high speed, packed as dense as possible. Ever growing requirement of power, performance and area led us to process nodes… Read More
Making your ARMs POP
Just in time for TSMC’s technology symposium (tomorrow) ARM have announced a whole portfolio of new Processor Optimization Packs (POPs) for TSMC 40nm and 28nm. For most people, me included, my first question was ‘What is a POP?’
A POP is three things:
- physical IP
- certified benchmarking
- implementation knowledge
The Truth of TSMC 28nm Yield!
As I write this I sit heavyhearted in the EVA executive lounge returning from my 69[SUP]th[/SUP] trip to Taiwan. I go every month or so, you do the math. This trip was very disappointing as I can now confirm that just about everything you have read about TSMC 28nm yield is absolutely MANURE!… Read More
Arteris evangelization High Speed Interfaces!
Kurt Shuler from Arteris has written a short but useful blog about the various high speed interface protocols currently used in the wireless handset (and smartphone) IP ecosystem. Arteris is well known for their flagship product, the Network-on-Chip (NoC), and the Mobile Application Processor market segment represent the … Read More
Handsets, what’s up?
So who’s in and who’s out these days in handsets?
It looks as if Samsung has finally achieved a long-held goal to be the largest handset vendor, taking over from Nokia which has been the market leader for 14 years since 1998 when it passed Motorola. Nokia hasn’t reported yet but they cut their forecast. Samsung … Read More
Chip in the Clouds – "Gathering"
Cloud computing is the talk of the tech world nowadays. I even hear commentaries about how entrepreneurs are turned down by venture capitalists for not including a cloud component into their business plan no matter what the core business may be. The commentary goes “It’s cloudy without any clouds.” Add some clouds to your strategy… Read More
I Love DAC
For the fourth year Atrenta, Cadence and Springsoft are jointly sponsoring the “I LOVE DAC” campaign. In case you have been hibernating all winter, DAC is June 3-7th in San Francisco at the Moscone Center.
There are two parts to “I LOVE DAC”. First, if you register by May 15th (and they haven’t all… Read More
EDPS: 3D ICs, part II
Part I is here.
In the panel session at EDPS on 3D IC a number of major issues got highlighted (highlit?).
The first is the problem of known-good-die (KDG) which is what killed off the promising multi-chip-module approach, perhaps the earliest type of interposer. The KDG problem is that with a single die in a package it doesn’t… Read More
Doing what others don’t do
Wally Rhines’ keynote at U2U, the Mentor users’ group meeting, was about Mentor’s strategy of focusing on what other people don’t do. This is partially a defensive approach, since Mentor has never had the financial firepower to have the luxury of focusing all their development on sustaining their products and then make … Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay