When Software Outruns Silicon: Hardware-Assisted Test Generation to the RescueFor the past decade, the semiconductor industry has…Read More
From Tokens to Infrastructure: Why Compute, Memory, and Power Will Determine the Future of AIBased on Dylan Patel’s SEMI Industry Strategy Symposium…Read More
Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?Intel’s 18A process technology has become one of…Read More
WEBINAR: Why Google Cloud NetApp Volumes Matter for Modern EDA WorkloadsIn this webinar, Google Cloud and NetApp explore…Read More
How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too LateEmbedded systems programs often fail because critical engineering…Read More
I was in Tanzania a few weeks ago. One of the conceits that we have in the US is that we lead the world in technology. That is true in many areas but in mobile the US is a laggard. Just look at the fuss made about NFC payments in the new iPhone given that Japan had mobile payments over a decade ago.
Another area where the US is a laggard, or maybe… Read More
The first consumer products with 20nm processing are arriving in 2014 like the 2 billion transistor A8 chip in the iPhone 6, however at the 14nm node there are new designs underway to continue the trend of Moore’s Law. To get a better feel for the challenges of designing with 14nm FinFET technology I watched a 23 minute video … Read More
When we get the notion of expansion of a company, it always provides a positive picture about something good happening to boost that expansion. There can be several reasons for expansion such as merger & acquisition, formation of joint venture or partnership, large customer orders and so on. However, organic expansion which… Read More
Semiconductor companies continue to use the traditional corner-based signoff approach that has been developed more than 40+ years ago and has since remained mainly unchanged as an industry paradigm. Initially it had 2 corners, namely Worst Case (WC) and Best Case (BC) with the maximum and minimum cell delay respectively. Note… Read More
Even though Xilinx FPGAs seem to keep growing in densities and gobbling up boards into a single part, there is still the need for chip to chip connectivity and of course backplane connectivity. Xilinx 20nm UltraScale, TODAY, can really move 28 gb/s over the back plane. This is something that you cannot do with Altera 20nm, they are… Read More
Power devices have historically been made from silicon (Si), which has reached the limit of electric power loss reduction. With the superior physical and electrical properties of silicon carbide (SiC), we can expect to see a significant expansion in the amount of electric power conversion of electrical equipment as well as reduced… Read More
The previous blog I did on the density difference between Intel 14nm and TSMC 20nm caused quite a stir and many interesting comments which I would like to address. After writing thousands of blogs on a wide variety of topics I have found that playing the devil’s advocate stimulates the most productive conversations and in this case… Read More
The official term is “beneficiary rule”, but among colorful racing broadcasters, drivers, and fans it is more commonly referred to as the “lucky dog”: the driver who is down a lap, but gets to advance to the lead lap by virtue of being farthest ahead when a caution flag is raised.
Qualcomm has lapped the entire field when it comes to … Read More
One of the things about MEMS devices is that they almost always live on a chip that also contains the electronics necessary to process the output from the sensor. For example, an on-chip accelerometer for a car airbag deployment will contain the electronics necessary to process the signal from the sensor and end up with something… Read More
Larry Ellison resigning as CEO of Oracle caught me by surprise. I definitely did not see that one coming. Talk about the end of an era, as a 30+ year Silicon Valley veteran there have been quite a few industry icons that stand out amongst the others: Dave Packard, Bill Hewlett, Gordon Moore, Andy Grove, Bill Gates, Steve Jobs, and Larry… Read More
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Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?