Get together with your fellow industry peers and insiders at the monthly EDAC Mixer, to the benefit of local charities. You don’t need to donate anything, you just show up and pay for your own drinks. A portion of the proceeds will go to local charities, this month to the Mountain View Educational Foundation (MVEF), a volunteer… Read More



Grid Vision 2050 – Unified & Open Across The Globe
Whenever there is good momentum in a particular technology, IEEEtakes major initiative to standardize the procedures, formats, methods, measurements etc. involved in the technology to proliferate it for the advantage of wider community. And that becomes successful by active participation and collaboration of both producers… Read More
Why Intel 14nm is NOT a Game Changer!
On one hand the Motley Fool is saying, “Intel 14nm could change the game” and on the other hand the Wall Street Cheat Sheet is saying, “Intel should shut down mobile”. SemiWiki says Intel missed mobile and should look to the future and focus on wearables and in this blog I will argue why.
Let’s look back to 2009 when Intel and TSMC signed… Read More
RTL Sign-off – At an Edge to become a Standard
Ever since I have seen Atrenta’s SpyGlass platform providing a comprehensive set of tools across the semiconductor design paradigm, I felt the need for a common set of standards to evolve for sign-off at RTL level. Last December, when I read an EE Times articleof Piyush Sancheti, VP, Product Marketing at Atrenta, where he talks … Read More
Power and Thermal Modeling Approach for Embedded and Automotive using ESL Tools
Did you know that an S-class Mercedes Benz can use 100 microprocessor-based electronic control units (ECUs) networking throughout the vehicle that run 20-100 million lines of code (Source: IEEE)?
2014 Mercedes-Benz CLA
Here’s a quick list of all the places that you will find software controlling hardware in an automobile:… Read More
How Do You Verify a NoC?
Networks-on-chip (NoCs) are very configurable, arguably the most configurable piece of IP that you can put on a chip. The only thing that comes close are highly configurable extensible VLIW processors such as those from Tensilica (Cadence), ARC (Synopsys) and CEVA but Sonics would argue their NoCs are even more flexible. But … Read More
Update on a Space-Based Router for IC Design
When I started my IC design career back in 1978 all IC routing was done manually, today however we have many automated approaches to IC routing that save time and do a more thorough job than manual routing. To get an update on space-based routers for IC design I connected with Yuval Shay at Cadence today. The basic idea behind a spaced-based… Read More
SOI Future or Flop?
Silicon On Insulator (SOI) is a technology that has been in use by the semiconductor industry for a long time. Early technologies such as Silicon On Sapphire (SOS) were reported as early as the sixties. In the eighties technologies such as V groove dielectric isolation were used. In the nineties we saw wafer bonding become the most… Read More
Getting the best from MIPI IP Toolbox
The set of MIPI specifications has severely enlarged during the past year. This is a positive point, as the large set of specifications induces a wider choice, and a chip maker can decide to implement a complex specification to differentiate with competitors, or select a specification just tailored to support a basic architecture… Read More
Untangling snags earlier and reducing area by 10%
The over 20 years of experience behind Synopsys Design Compiler is getting a new look for 2014, and we had a few minutes with Priti Vijayvargiya, director of product marketing for RTL synthesis, to explore what’s in the latest version of the synthesis tool.
Previewed today, Synopsys Design Compiler 2013.12 continues to target … Read More
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