Double SoC prototyping performance with S2C’s VP1902-based S8-100As AI, HPC, and networking applications demand ever-higher…Read More
CEO Interview with Dr. Maksym Plakhotnyuk of ATLANT 3DDr. Maksym Plakhotnyuk, is the CEO and Founder…Read More
Altair SimLab: Tackling 3D IC Multiphysics Challenges for Scalable ECAD ModelingThe semiconductor industry is rapidly moving beyond traditional…Read More
At the heart of fabricating integrated circuits is the ability to selectively change the electrical properties of the semiconductor substrate. This key to fabrication is accomplished by doping – introducing atoms locally into the semiconductor substrate.
In the early days of the semiconductor industry doping was accomplished… Read More
I’m not at CES so I’m reporting second hand. But Samsung made some announcements and, since they didn’t make any mobile announcements, people were disappointed. Like Don Dingee, I think that any major mobile announcements will be done in March at Mobile World Congress. Although CES is starting to get a little… Read More
I’m an avid cyclist that rode some 6,744.3 miles in 2014, according to www.strava.com, a free web site and popular app for road bikers like me. At CES this week I’ve read about many creative devices and apps to make your cycling experience better, so here’s my take on all of it.… Read More
The news Qualcomm has shipped over a billion Snapdragon chips in Android smartphones broke last September. After reiterating that and a sustained outlook for smartphones over the next five years, the Qualcomm CES 2015 presser seemed to leave most media outlets a bit disappointed. Naturally, that prompts us to ask what is going… Read More
Russ Fischer of Seeking Alpha fame just posted another article on Intel which, for a change, I agree wholeheartedly with except of course the part where he comments on the fabless semiconductor ecosystem, something he knows nothing about. But other than that it is definitely worth a read because as investments go Intel is certainly… Read More
I have seen a couple of posts comparing the density of the Apple A8 to the Intel Core M and concluding that the TSMC 20nm process is denser than the Intel 14nm process. In one of the threads one of the posters likened this to comparing apples to oranges, I agree except I think it is even worse than that, I think it is more like comparing apples… Read More
Recently I attended a panel discussion on variability in semiconductor fabrication hosted by Coventor in conjunction with the IEEE IEDM conference in San Francisco. The IEEE bills the conference as “the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device… Read More
QuickLogic Corp.—the former FPGA maker that reinvented itself through configurable design for consumer electronics (CE) products—is taking its sensor hub arsenal to high pitch at the 2015 International Consumer Electronics Show (CES) in Las Vegas. Sensor hub, a companion to application processor, offloads data from sensors… Read More
With growing SoC size, complexity, software and hardware content in it and shrinking time-to-market, the SoC design completion in time has become increasingly dependent on IP which need to be sourced (internally or externally), customized according to the design need and integrated together into the SoC. While IP providers… Read More
Microprocessor vendors such as Andes have been saying for some time that security requires extensive hardware support. In particular, embedded processors in intelligent sensors inside IoT chips are now popular targets for hackers, who find it easy to change the program code and system parameters to alter the operation of the… Read More
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