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A Connectivity Verification Idea

A Connectivity Verification Idea
by Bernard Murphy on 10-14-2015 at 4:00 pm


A Wirble

In case you hadn’t noticed, I like to write from time to time about EDA product ideas. I assume these are somewhat original, but given the maxim “there’s nothing new under the sun…”, I may well be wrong. In any event, I like to share these ideas if only to demonstrate that innovation in EDA is not stalled because we’ve run out big,… Read More


EUV sees further delays?

EUV sees further delays?
by Robert Maire on 10-14-2015 at 12:00 pm

Headwinds which will likely continue into 2016…
ASML reported revenues of 1.55B Euros with EPS of 0.75 Euros more or less in line with expectations. Orders were the weak spot, falling to 904M Euros versus the previous Q2 orders of 1.523B Euros. The company guided Q4 revenues to be down about 10% to 1.4B Euros below current flattish… Read More


Why ARM Enabling Easy Access to Customized SOC’s Matters

Why ARM Enabling Easy Access to Customized SOC’s Matters
by Tom Simon on 10-14-2015 at 7:00 am

The introduction of the Arduino heralded the huge growth and interest in MCU based designs by people who could never before easily put together the hardware and software system required for implementation of their ideas. I remember the first time I saw the Arduino in use. I was at a talk on how a system for controlling propane jet solenoids… Read More


Optimizing Quality-of-Service in a Network-on-Chip Architecture

Optimizing Quality-of-Service in a Network-on-Chip Architecture
by Tom Dillinger on 10-13-2015 at 12:00 pm

The Linley Group is well-known for their esteemed Microprocessor Report publication, now in its 28th year. Accompanying their repertoire of industry reports, TLG also sponsors regular conferences, highlighting the latest developments in processor architecture and implementation.

One of the highlights of the conference… Read More


Convolutional Deep Neural Network is now a reality with CEVA-XM4

Convolutional Deep Neural Network is now a reality with CEVA-XM4
by Eric Esteve on 10-13-2015 at 7:00 am

XM4 DSP has been enriched with CEVA Deep Neural Network (CDNN) Software Framework. Some explanation could be useful before jumping into CDNN. The “Deep” of CDNN comes from “Deep Learning”, a family of neural network methods using high number of layers, so a deep network. The most popular deep learning neural network method is the… Read More


Wi-Fi Pioneers: Where are they now?

Wi-Fi Pioneers: Where are they now?
by Majeed Ahmad on 10-12-2015 at 4:00 pm

Wi-Fi is the unsung hero of the mobile revolution. Some people even call it the real Internet. In retrospect, smartphones took off partly because Apple forced mobile operators to seriously consider handsets with Wi-Fi capabilities. Now Wi-Fi is an intrinsic networking component serving smartphones, tablets and notebook computers… Read More


SpyGlass World at Levi Stadium, October 21st

SpyGlass World at Levi Stadium, October 21st
by Bernard Murphy on 10-12-2015 at 2:00 pm

I suppose you might have something better to do next Wednesday but, seriously, it had better be pretty good. I admit I’m biased (I was the Atrenta CTO until very recently) but even given that and mixing metaphors, Atrenta really knocked it out of the park when they got the 49er stadium for their User Group meetings. You don’t have to … Read More


3 Self-Service Semiconductor Design and Manufacturing Wins!

3 Self-Service Semiconductor Design and Manufacturing Wins!
by Daniel Nenni on 10-12-2015 at 12:00 pm

As the semiconductor consolidation continues and thousands of semiconductor professionals update their LinkedIn profiles, the march to create new silicon opportunities is increasing at a rapid pace. It is 1980s deja vu all over again when the fabless business model reenergized the semiconductor industry and brought affordable… Read More


Tensilica 4th generation DSP IP is a VPU

Tensilica 4th generation DSP IP is a VPU
by Eric Esteve on 10-12-2015 at 7:00 am

You may not know Tensilica DSP IP core, but you probably use Tensilica DSP powered systems in your day to day life. Every year, over 2 billion DSP cores equip IC in thousands of designs supporting IoT, Mobile Phones, Storage/SSD, Networking, Video, Security, Cameras… and more. Why DSP processing, the foundation of all Tensilica… Read More


Meeting DFM Challenges with Hierarchical Fill Data Insertion

Meeting DFM Challenges with Hierarchical Fill Data Insertion
by Tom Dillinger on 10-11-2015 at 12:00 pm

To describe the latest methodology for the addition of Design for Manufacturability fill shapes to design layout data, it’s appropriate to borrow a song title from Bob Dylan – The Times They Are A Changin’. The new technical requirements are best summarized as: “The goal is now to add as much fill as possible, which (ideally) looksRead More