You may have heard of the Landauer principle or the Landauer limit. This defines a lower bound on switching power dissipation in any form of digital circuit. Rolf Landauer first presented this principle in 1961, while working at IBM. It’s not limited by how the circuit is built – you can use FinFETS or spintronics or even dilithium… Read More
Elevating AI with Cutting-Edge HBM4 TechnologyArtificial intelligence (AI) and machine learning (ML) are…Read More
WEBINARS: Boost Your Simulation and Modeling EfficiencyUnlock the full potential of your semiconductor designs…Read More
Asia Driving Electronics GrowthElectronics production in the major developed countries has…Read More
Automating Reset Domain Crossing (RDC) Verification with Advanced Data AnalyticsThe complexity of System-on-Chip (SoC) designs continues to…Read More
How LETI IP will speed-up GlobalFoundries 22FDX™ ASIC Development
GlobalFoundries has positioned FDSOI proposal -22FDX- to provide better performance and power dissipation than competitive FDSOI offers on 28nm node. The FDSOI licensing agreement between LETI and GlobalFoundries is only a couple of months old (July 2015), but the real work has started in Dresden as several engineers from … Read More
Samsung’s Luck with Gear S2
The wave of new and improved smartwatches started this year. Apple launched its first smartwatch in April. Several other players including Motorola, LG, ASUS, and Huawei have launched their new smartwatches this year. Sony launched its latest ‘SmartWatch 3’ in October last year. Rising consumer electronics brands like Xiaomi… Read More
ARM Server Chips: What Qualcomm Wants?
Qualcomm has made the long-awaited foray into the ARM-based server chipsets and the trade media is presenting its 24-core SoC prototype as a challenger to Intel’s hegemony in the cloud server market. Is it so?… Read More
Extendible Processor Architectures for IoT Applications
The Internet of Things has become a ubiquitous term, to refer to a broad (and somewhat ill-defined) set of electronic products and potential applications – e.g., wearables, household appliances and controllers, medical applications, retail applications (signage, RFID), industrial automation, machine-to-machine communication,… Read More
IoT chipsets and enterprise emulation tools
When most people talk about the IoT, it is usually all about wearables-this and low-power-that – because everyone is chasing the next huge consumer post-mobile device market. Mobile devices have provided the model. The smartphone is the on-ramp to the IoT for most consumers, with Bluetooth, Wi-Fi, and LTE, and maybe a dozen or … Read More
Is the IP market expected to decline by 2020?
To answer this question, I will share the results about Interface IP, more precisely the Top 5. The Top 5 protocols, USB, PCIe, Ethernet, DDRn and MIPI, are part of the interface IP market and each of them has been characterized by very strong growth rate. If you compute actual numbers for 2010 to 2014, it results to a Cumulated Annual… Read More
Learning about 3D Integration of ICs and Systems
We blog a lot about Moore’s Law, and even “More than Moore” where 3D integration of ICs and systems are used to get lower product costs. One big challenge with 3D integration of ICs is that most EDA software was really intended only for abstracting at 2D or 2.5D structures. Over the past several years there have … Read More
Our Own Cadence Amongst the Best Multinational Workplaces!
There were some very happy faces around MemCon this week for a variety of reasons. Paul McLellan was smiling because he now works full time for Cadence and has the best medical benefits ever and of course I was smiling because there was free food! … Read More
Wafer-Level Chip-Scale Packaging Technology Challenges and Solutions
At the recent TSMC OIP symposium, Bill Acito from Cadence and Chin-her Chien from TSMC provided an insightful presentation on their recent collaboration, to support TSMC’s Integrated FanOut (InFO) packaging solution. The chip and package implementation environments remain quite separate. The issues uncovered in bridging… Read More
TSMC 16th OIP Ecosystem Forum First Thoughts