IHS has put out its 1Q2016 Application Market Forecast predicting the highest growth rate segments for semiconductors over the next five years – and what was once old is new yet again. There it is, in the top right corner: industrial, projected to outpace even the automotive sector.… Read More
Agentic AI and the EDA Revolution: Why Data Mobility, Security, and Availability Matter More Than EverThe EDA (Electronic Design Automation) and semiconductor industries…Read More
WEBINAR: What It Really Takes to Build a Future-Proof AI Architecture?Keeping up with competitors in many computing applications…Read More
Software-defined Systems at #62DACModern EVs are prime examples of software-defined systems,…Read More
Unlocking Efficiency and Performance with Simultaneous Multi-ThreadingAn Akeana hosted webinar on Simultaneous Multi-Threading (SMT)…Read More
How TSMC Tackles Variation at Advanced Nodes
The design community is always hungry for high-performance, low-power, and low-cost devices. There is emergence of FinFET and FDSOI technologies at ultra-low process nodes to provide high-performance and low-power requirements at lower die-size. However, these advanced process nodes are prone to new sources of variation.… Read More
Google, Deep Reasoning and Natural Language Understanding
Understanding natural language is considered a hard problem in artificial intelligence. You could be forgiven for thinking this can’t be right – surely language recognition systems already have this problem mostly solved? If so, you might be confusing recognition with understanding – loosely, recognition is the phonology… Read More
How Microsoft Could Become A Mobile Player
Microsoft BUILD is the company’s annual developer conference where they communicate their latest strategies and deliverables to developers and launch many new innovations. BUILD is extremely developer- focused and is intended to inform current Microsoft developers as well as recruit more developers to develop for Microsoft… Read More
How AT&T Will Turn on Car 2 Car Connectivity
Cnet reports that, starting this week, AT&T is offering “Unlimited Plan” customers the option to add connected cars or a ZTE Mobley Wi-Fi plug-in device to their plan for $40/month for unlimited data – $10/month will buy 1GB. The plan applies to certain Buick, Audi, Chevrolet, Cadillac, GMC, Jaguar, Land… Read More
Banks and Retailers need to win in IOT
In the runtime for the current mobile ecosystem – apps:
- Average user has 21 apps on her smart phone, out of the total 1.5m apps on app-store
- While apps account for more than half the time user spends on digital/smart platform, an average user spend more than 40% of that time on a single app
- 2/3rd of all smartphone user did not download
ARM tests out TSMC 10FinFET – with two cores
About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More
Who protects power protection chips?
Power protection chips are widely used these days to protect sensitive circuitry from over-voltage and over-current stress. However, these workhorse chips are often subjected to extraordinary thermal stress themselves and need to be protected from burning up – literally.
Power protection chips work like electronic fuses,… Read More
IMEC Technology Forum (ITF) – IC Innovation
IMEC is a technology research center located in Belgium that is one of the premier semiconductor research centers in the world today. The IMEC Technology Forum (ITF) is a two-day event attended by approximately 1,000 people to showcase the work done by IMEC and their partners.
Luc Van Den Hove is the president and CEO of IMEC and he… Read More
TSMC Leads Again with 3-D Packaging!
Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.
CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More
Should Intel be Split in Half?