Banner 800x100 0810

ARM gets wider and more flexible in vectors

ARM gets wider and more flexible in vectors
by Don Dingee on 08-22-2016 at 4:00 pm

ARM has a storied history of announcing major architecture changes at conferences far in advance of product implementations to get their ecosystem moving. At Hot Chips 2016, their sights are set on revamping the ARMv8-A architecture for a new generation of server and high-performance computing parallelism with a preview of … Read More


Did My FPGA Just Fail?

Did My FPGA Just Fail?
by Daniel Payne on 08-22-2016 at 12:00 pm

Designing DRAMs at Intel back in the 1970s I first learned about Soft Errors and the curious effect of higher failure rates of DRAM chips in Denver, Colorado with a higher altitude than Aloha, OR. With the rapid growth of FPGA-based designs in 2016, we are still asking the same questions about the reliability of our chips used for safety-critical… Read More


A New Player in the Functional Verification Space

A New Player in the Functional Verification Space
by Bernard Murphy on 08-22-2016 at 7:00 am

Israel has a strong pedigree in functional verification. Among others, Verisity (an early contributor to class-based testbench design and constrained random testing) started in Israel and RocketTick (hardware-based simulation acceleration), acquired more recently by Cadence, is based in Israel. So when I hear about an … Read More


AMAT reports strong Q and even better guidance

AMAT reports strong Q and even better guidance
by Robert Maire on 08-21-2016 at 4:00 pm

Last quarter we said that AMAT got its mojo back and it appears to have even picked up speed going into the end of a strong year.

The display business which had been less than reliable in years past has come up with back to back home runs. Applied is growing both its top and bottom line at well above the sluggish market rates and is clearly… Read More


Alphabet vs. Radio: Traffic Info Smackdown

Alphabet vs. Radio: Traffic Info Smackdown
by Roger C. Lanctot on 08-21-2016 at 12:00 pm

Alphabet is showing signs of taking over just about every infotainment function in cars except one: traffic information. When Alphabet, aka Google, arrived on the automotive scene the company and its minions quickly grasped that there was going to be a big opportunity for search, voice, navigation, maps, traffic and contextual… Read More


Five Ways IoT is Changing Trends in Cognitive Business

Five Ways IoT is Changing Trends in Cognitive Business
by Bill McCabe on 08-21-2016 at 7:00 am

How is the Internet of Things, or IoT, changing trends in cognitive business? The impact is evident with the alliance between computers and humans. Computers still quickly assimilate and spew out data based on what is seen, heard and read. The difference is that they are now reasoning, understanding, and learning from those processes,… Read More


4 Reasons for Bluetooth 5 Adoption in IoT

4 Reasons for Bluetooth 5 Adoption in IoT
by Eric Esteve on 08-21-2016 at 4:25 am

IoT devices have to be connected but power consumption is usually a real concern. If you think about wearables, like for example fitness wristbands, the time between charges could make or break the product. Even if Wi-Fi looks attractive to connect an IoT device, the system developers have quickly realize that the power consumption… Read More


What is Inside the iPhone 7?

What is Inside the iPhone 7?
by Daniel Nenni on 08-20-2016 at 7:00 am

TSMC is the bellwether for not only the foundry business, since they are the dominant player, but also the semiconductor industry as a whole. You could also argue that TSMC is a sneak peek into the world economy since they build capacity based on their customer’s forecasts and the world now revolves around semiconductors.

The other… Read More


More on HAPS hybrid prototyping for ARMv8 with Linaro

More on HAPS hybrid prototyping for ARMv8 with Linaro
by Don Dingee on 08-19-2016 at 4:00 pm

A few weeks ago we previewed a Synopsys webinar describing how they are linking the ARM Juno Development Platform with the HAPS-80 and HAPS ProtoCompiler environment. I’ve had a look at the archived event and have some additional thoughts.… Read More


The Package Assembly Design Kit (PADK)… the start of something big

The Package Assembly Design Kit (PADK)… the start of something big
by Tom Dillinger on 08-19-2016 at 12:00 pm

Integrated wafer-level fanout (WLFO) packaging technology is emerging as a foundation for multi-die solutions. Mobile product applications require focus on both aggressive chip-to-chip interface performance, as well as the final package volume. Traditional multi-chip packages using PCB laminate substrates do not readily… Read More