Executives from the major EDA companies attend the Design Automation Conference to introduce new product features, describe new initiatives and collaborations, meet with customers, and participate in lively conference panel discussions. Daniel Nenni and I were fortunate to be able to meet with Joe Sawicki, Executive Vice… Read More
Agentic Bug Localization. Innovation in VerificationBug localization continues to be a challenge for…Read More
Why chip design needs industrial-grade EDA AIBy Niranjan Sitapure Artificial intelligence (AI) is reshaping…Read MoreConsidering SiFive: What Should I Get to Implement a RISC-V Core?
I have an old weathered leather-clad black notebook with a National Semiconductor logo on its face that I have used since 2001. It has sentimental value to me. First, it reminds me of where I was on 9/11, having breakfast with a group of attendees to National Semiconductor’s executive event in Laguna Niguel, CA. We were going to play… Read More
Intel let there be RAM
The “20 Questions with John East” series continues
Intel was founded in 1968 by Robert Noyce and Gordon Moore who had left Fairchild earlier that year. They immediately hired Andy Grove. Noyce, Moore and Grove were a study in contrasts. I had various dealings over the years with Noyce and Grove, but have met Moore only twice. They… Read More
Google Trustworthy Response to Product Vulnerabilities Demonstrates Leadership
I applaud Google for taking extraordinary steps to protect and service their customers by offering free replacements for the Titan Bluetooth Security Keys. Such product recalls can be expensive, time consuming, and prolong negative stories in the news cycles, yet it is the right thing to do.
Many companies would choose instead
Ecomotion 2019 We are All Jews
While listening to Krista Tippet’s National Public Radio program “On Being” recently I learned of the Hebrew expression familiar to Jews: “tikkun olam.” The expression captures what is described in Wikipedia as an obligation observed by all Jews “to repair the world.”
To be sure, this is an over-simplification of the meaning… Read More
Custom SRAM IP @56thDAC
The electronics industry strives to continuously introduce new product innovation and differentiation. The ASIC market arose from the motivation to offer unique (cost-reduced) integration that was not realizable with commodity MSI/LSI parts. The SoC market evolved to provide even greater differentiation, integrating… Read More
The Implications of the Rise of AI/ML in the Cloud
Recently, Daniel Nenni blogged on the presentation Wally Rhines gave at #56th DAC. Daniel provided a great summary, but I want to dive into a portion of the presentation in more detail. I love Wally’s presentations, but sometimes you cannot absorb the wealth of information he provides when you initially see it. It’s… Read More
#56thDAC SerDes, Analog and RISC-V sessions
The good news is that the next five DAC events will take place in Moscone Center in San Francisco! If going to Las Vegas from the Bay area is an easy trip, coming from Europe to Las Vegas makes it a 24+hours journey… One obvious consequence was the poor attendance to the exhibition floor. But let’s be positive and notice that the number… Read More
TSMC in the Cloud Update #56thDAC 2019
During my Taiwan visit, prior to Las Vegas, I was fortunate to spend time with Willy Chen and Vivian Jiang to prepare for the cloud panel I moderated at #56thDAC. Willy and Vivian are part of the ever-important Design Infrastructure Marketing Division of TSMC, which includes the internal and external cloud efforts. TSMC first announced… Read More
SpaceX: Starlink to Carlink
When SpaceX launched 60 satellites into orbit last month – the first of a planned fleet of 12,000 such satellites which will ultimately deliver terrestrial Internet access in concert with earth-bound stations – astronomers were alarmed at the apparent impact on earth-based observatories from light pollution.… Read More




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