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CEO Interview: Ljubisa Bajic of Tenstorrent

CEO Interview: Ljubisa Bajic of Tenstorrent
by Daniel Nenni on 07-31-2020 at 6:00 am

Ljubisa Bajic of Tenstorrent

Ljubisa Bajic is the CEO of Tenstorrent, a company he co-founded in 2016 to bring to market, full-stack AI compute solutions  with a compelling new approach to address the exponentially growing complexity of AI models.

What is Tenstorrent?

Tenstorrent is a next-generation computing company that is bringing to market the first… Read More


DAC Panel – Artificial Intelligence Comes to CAD: Where’s the Data?

DAC Panel – Artificial Intelligence Comes to CAD: Where’s the Data?
by Tom Simon on 07-30-2020 at 10:00 am

Which problems are ripe for AIML

Artificial Intelligence (AI) and Machine Learning (ML) are becoming more and more commonplace in our world. We have Siri, Alexa and Google Assistant that understand our voice commands. Vision systems that recognize objects are used for facial recognition, autonomous driving, medical, geographical and many other applications.… Read More


Imec Technology Forum and ASML

Imec Technology Forum and ASML
by Scotten Jones on 07-30-2020 at 6:00 am

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On Thursday July 9 Imec held a virtual technology forum. Imec is one of the premier research organizations working on semiconductor technology and their forums are always interesting. My area of interest is process technology and the following are my observation in that area from the forum.

Luc Van Den Hove
Luc Van Den Hove is the… Read More


Designing AI Accelerators with Innovative FinFET and FD-SOI Solutions

Designing AI Accelerators with Innovative FinFET and FD-SOI Solutions
by Daniel Nenni on 07-29-2020 at 10:00 am

Globalfoundries AI Webinar Hiren Majmudar

I had the pleasure of spending time with Hiren Majmudar in preparation for the upcoming AI Accelerators webinar. As far as webinars go this will be one of the better ones we have done. Hiren has deep experience in both semiconductors and EDA during his lengthy career at Intel and now with a pure play foundry. He is intelligent, personable,… Read More


DAC Panel: Cadence Weighs in on AI for EDA, What Applications, Where’s the Data?

DAC Panel: Cadence Weighs in on AI for EDA, What Applications, Where’s the Data?
by Mike Gianfagna on 07-29-2020 at 6:00 am

Drivers of Convergence in Computational Software

DAC was full of great panels, research papers and chip design stories this year, the same as other years. Being a virtual show, there were some differences of course. I’ve heard attendance was way up, allowing a lot more folks to experience the technical program.  This is likely to be true for a virtual event. I’m sure we’ll see more… Read More


#57DAC – Panel Discussion of High Level Synthesis

#57DAC – Panel Discussion of High Level Synthesis
by Daniel Payne on 07-28-2020 at 10:00 am

sean dart, Cadence

Presenters took a trip down memory lane at DAC this year by having a panel discussion on HLS (High Level Synthesis) spanning from 1974 to 2020, and that time period aligns with when I first graduated from the University of Minnesota in 1978, starting chip design at Intel, then later transitioning into EDA companies by 1986. MarilynRead More


Low Power and RISC-V Talks at DAC2020, Hosted by Mentor

Low Power and RISC-V Talks at DAC2020, Hosted by Mentor
by Bernard Murphy on 07-28-2020 at 6:00 am

low battery

I’m going to get to low power and RISC-V, but first I’m trying out virtual DAC this year. Seems to be working smoothly, aside from some glitches in registration. But maybe that’s just me – I switched email addresses in the middle of the process. Some sessions are live, many pre-recorded, not quite the same interactive experience… Read More


A SoC Design Flow With IP-XACT

A SoC Design Flow With IP-XACT
by Ranjit Adhikary on 07-27-2020 at 10:00 am

soc flow with ipxact

Taping out a SoC is never easy. The physical dimensions of the chip often belie the work which has been done to get to the tapeout stage. And it is still not a done deal as the hardware and software development teams await the arrival of the test chip from the foundry to complete the post silicon bring-up and validation. The pressure on… Read More


Synopsys Webinar: A Comprehensive Overview of High-Speed Data Center Communications

Synopsys Webinar: A Comprehensive Overview of High-Speed Data Center Communications
by Mike Gianfagna on 07-27-2020 at 6:00 am

Screen Shot 2020 07 25 at 8.43.22 PM

High-speed communication is a critical component for many applications, most notably in the data center. The serializer/deserializer physical interface, or SerDes PHY is the backbone of many different forms of high-speed communication for this application. Use cases include on chip, between chips, between boards and racks… Read More


VLSI Symposium 2020 – Imec Buried Power Rail

VLSI Symposium 2020 – Imec Buried Power Rail
by Scotten Jones on 07-26-2020 at 10:00 am

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The 2020 VLSI Technology Symposium was held as a virtual conference from June 14th through June 19th. At the symposium Imec gave an interesting paper on Buried Power Rails (BPR) and I had a chance to interview one of the authors, Anshul Gupta.

As logic devices continue to scale down metal pitch is reaching a limit. Imec defines a pitch… Read More