Previous SemiWiki articles have discussed the introduction of embedded Spin-Transfer Torque Magnetoresistive RAM IP from GLOBALFOUNDRIES, as an evolution replacement for non-volatile embedded flash memory. (link, link)
Those articles described the key features of STT-MRAM technology, but didn’t delve into a key reliability… Read More
Electronics production continues to recover from the COVID-19 pandemic. However, the recovery is mixed by country. The chart below shows three-month-average (3/12) change versus a year ago in electronics production by local currency for key Asian countries. China was averaging about 10% growth prior to the pandemic. After… Read More
I had the opportunity to speak with Pete Rodriguez and Alain Labat in regards to the upcoming webinar on M&A. I have worked with both Pete and Alain in the past so I can tell you personally that this event will be well worth your time. This is truly an all star cast with a collective experience base with billions of dollars worth of … Read More
Security is a slippery topic. We all agree that “something should be done”, but most of us are waiting for someone else to lead the way. There’s no shortage of proprietary solutions, though given the distributed nature of the problem it’s difficult to see how those separately or collectively can rise to the occasion. What we really… Read More
EDA Flows for 3D Die Integrationby Tom Dillinger on 07-20-2021 at 6:00 amCategories: Cadence, EDA, Events
Background
The emergence of 2.5D heterogeneous die integration using a silicon (or organic) interposer has enabled unique system architectures. The term “More than Moore” has been used to describe the circuit density and cost advantages of leveraging multiple die in the package, the die potentially in different process technologies. … Read More
The causes of the chip shortage crisis have been widely discussed, but what about specific solutions? How can semiconductor manufacturers add new capacity to meet demand as quickly as possible?
While there is a lot of talk about investment in building new chip plants, these traditional methods of manufacturing capacity growth… Read More
At the 2021 VLSI Technology Symposium, Imec presented on Ruthenium (Ru) and Molybdenum (Mo) as alternate Word Line (WL) materials for 3D NAND Flash “First Demonstration of Ruthenium and Molybdenum Word lines Integrated into 40nm Pitch 3D NAND Memory Devices”. I had an opportunity to interview one of the authors: Maarten Rosmeulen.… Read More
Intel reportedly talking to Abu Dhabi to buy GloFo for $30B
Would jumpstart Intel Foundry but require investment & repair
Avoids IPO risk – Allows Abu Dhabi escape- NY benefits
Doesn’t impact near term shortage or market share
Reported by WSJ- Intel in talks to buy GloFo
The Wall Street Journal reported that Intel… Read More
Dan is joined by Lauri Koskinen, CTO and co-founder of Minima Technology. Dan explores the unique near-threshold design and operation of Minima’s energy optimized technology.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization,… Read More
CES 2026 and all things Cycling