The continued innovation and widespread adoption of connected devices — the internet of things (IoT) — has resulted in a vast range of conveniences that improve our lives every day. At the same time, the ubiquity of IoT devices, which market watchers estimate to be in the tens of billions, also makes it more attractive to bad actors… Read More





Enabling Silicon Technologies to Address Automotive Radar Trends and Requirements
During the week of April 19th, Linley held its Spring Processor Conference 2021. The Linley Group has a reputation for putting on excellent conferences. And this year’s spring conference was no exception. There were a number of very informative talks from various companies updating the audience on the latest research and development… Read More
From Silicon To Systems
The annual Siemens Digital Industries Software user group event was held virtually on May 26th, which made it easy to attend from my home office, although selecting from the list of speakers was a challenge, because they offered 475 sessions, wow. My focus is EDA, so I listened to Joseph Sawicki, the Executive Vice President, IC … Read More
5G Automotive Standards, Licensing Fosters Fast Adoption
The adoption of 5G technology in the automotive industry is proceeding quietly but rapidly. Indications are that 18 car makers from around the world have committed to the deployment of 5G connectivity but have largely done so without bold public statements.
The reason for this swift embrace of 5G has many dimensions, some of which
Upcoming Webinar: PUFiot, A NeoPUF-based Secure Co-Processor
Throughout history, people have sought after security as a basic right and expectation within a civilized society. Even as recent as a few centuries ago, things were very simple. Subjects looked to their rulers to provide security for their lives and assets. Assets were mostly hard assets such as jewelry, coins or real estate. … Read More
Contrast Reduction vs. Photon Noise in EUV Lithography
The stochastic behavior of images formed in EUV lithography has already been highlighted by a number of authors [1-3]. How serious it appears depends on the pixel size with which the photons are bunched. Generally, though, for features of around 20 nm or less, even 1 nm can have at least a +/- 15% gradient across it, which is still a
Podcast EP22: Intel’s IDM 2.0 and Their Venture Back into the Foundry Business
Dan is joined by Dr. Walden Rhines. Dan and Wally explore Intel’s re-entry to the foundry business. What is different this time and the implications of a worldwide supply chain are just some of the topics discussed in this far-reaching discussion of what lies ahead for the semiconductor industry.
The views, thoughts and … Read More
Heterogeneous Chiplets Design and Integration
Over the recent years, the volume and velocity of discussions relating to chiplets have intensified. A major reason for this is the projected market opportunity. According to research firm Omdia, chiplets driven market is expected to be $6B by 2024 from just $645M in 2018. That’s an impressive nine-fold projected increase over… Read More
Siemens EDA Acquires an IP Validation Tool for standard cells, IO and Hard IP
We’re living in an era of good growth for semiconductor design companies, and it’s no secret that each new SoC that comes along contains hundreds of IP blocks, so IP design re-use is just an accepted way of getting to market more quickly with lower risks. But how do we really know that all of the new IP is really correct? … Read More
Accellera Unveils PSS 2.0 – Production Ready
I recently had a discussion with Tom Fitzpatrick of Siemens and Faris Khundakjie of Intel on the latest release of the Portable Test and Stimulus Standard (PSS). Faris chairs the PSS working group and Tom is vice-chair. In what follows I synthesize feedback from both, sometimes I call out interesting individual comments. My first… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet