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Webinar: AMS, RF and Digital Full Custom IC Designs need Circuit Sizing

Webinar: AMS, RF and Digital Full Custom IC Designs need Circuit Sizing
by Daniel Payne on 01-02-2022 at 10:00 am

circuit sizing min

My career started out by designing DRAM circuits at Intel, and we manually sized every transistor in the entire design to get the optimum performance, power and area. Yes, it was time consuming, required lots of SPICE iterations and was a bit error prone. Thank goodness times have changed, and circuit designers can work smarter … Read More


White Paper: A Closer Look at Aging on Clock Networks

White Paper: A Closer Look at Aging on Clock Networks
by Tom Simon on 01-02-2022 at 6:00 am

Transistor Aging

We all know that designers work hard to reach design closure on SOC designs. However, what gets less attention from consumers is the effort that goes into ensuring that these chips will be fully operational and meeting timing specs over their projected lifetime. Of course, this is less important for chips used in devices with projected… Read More


Podcast EP55: A New Year’s Perspective with Dan and Mike

Podcast EP55: A New Year’s Perspective with Dan and Mike
by Daniel Nenni on 12-31-2021 at 10:00 am

Dan and Mike take some time to review 2021 – the events that led to growth, opportunities and challenges and a discussion of what lies ahead.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.… Read More


DAC 2021 – Cliosoft Overview

DAC 2021 – Cliosoft Overview
by Daniel Payne on 12-30-2021 at 6:00 am

Simon and Karim min

It’s been awhile since I really looked at what Cliosoft has to offer in the EDA tool space, so at the 58th DAC I stopped by their exhibit booth on Tuesday to visit with Karim Khalfan, VP of Application Engineering, and Simon Rance, VP of Marketing. Their booth had all of the hot market segments listed: Automotive, 5G, IoT, AI, … Read More


Heterogeneous Integration – A Cost Analysis

Heterogeneous Integration – A Cost Analysis
by Tom Dillinger on 12-29-2021 at 10:00 am

cost comparison

Heterogeneous integration (HI) is a general term used to represent the diverse possibilities for die technology incorporated into advanced 2.5D/3D packaging.  At the recent International Electron Devices Meeting (IEDM) in San Francisco, a team from Synopsys and IC Knowledge presented data from analyses of future potential… Read More


2D NoC Based FPGAs Valuable for SmartNIC Implementation

2D NoC Based FPGAs Valuable for SmartNIC Implementation
by Tom Simon on 12-29-2021 at 6:00 am

2D NoC SmartNIC

Smart network interface cards (SmartNICs) have proven themselves valuable in improving network efficiency. According to Scott Schweitzer, senior product manager at Achronix, it has been shown that SmartNICs can relieve up to – and perhaps beyond – 30% of the host processor’s loading. SmartNICs started out taking… Read More


Methodology for Aging-Aware Static Timing Analysis

Methodology for Aging-Aware Static Timing Analysis
by Tom Dillinger on 12-28-2021 at 10:00 am

char STA flow

At the recent Design Automation Conference, Cadence presented their methodology for incorporating performance degradation measures due to device aging into a static timing analysis flow. [1] (The work was a collaborative project with Samsung Electronics.)  This article reviews the highlights of their presentation.

BackgroundRead More


Delivering Systemic Innovation to Power the Era of SysMoore

Delivering Systemic Innovation to Power the Era of SysMoore
by Kalar Rajendiran on 12-28-2021 at 6:00 am

Evolving Landscape

With the slowing down of Moore’s law , the industry as a whole has been working on various ways to maintain the rate of growth and advancements. A lot has been written up about various solutions being pursued to address specific aspects. The current era is being referred to by different names, SysMoore being one that Synopsys uses.… Read More


DAC 2021 – Taming Process Variability in Semiconductor IP

DAC 2021 – Taming Process Variability in Semiconductor IP
by Daniel Payne on 12-27-2021 at 10:00 am

process node variability min

Tuesday at DAC was actually my very first time attending a technical session, and the presentation from Nebabie Kebebew, Siemens EDA, was called, Mitigating Variability Challenges of IPs for Robust Designs. There were three presentations scheduled for that particular Designer, IP and Embedded Systems track, but with the COVID… Read More


5 Talks on RISC-V

5 Talks on RISC-V
by Milos Tomic on 12-27-2021 at 6:00 am

Milos Tomic

Veriest recently hosted a webinar focusing on RISC-V as a forerunner of ongoing open-source revolution in chip design. Speakers were distinguished professionals from industry and academia. Webinar covered topics from market trends to open-source hardware initiatives, tools and methodologies.

Zvonimir Bandić: RISC-V Read More