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Today’s SoC Design Verification and Validation Require Three Types of Hardware-Assisted Engines

Today’s SoC Design Verification and Validation Require Three Types of Hardware-Assisted Engines
by Daniel Nenni on 09-06-2022 at 6:00 am

IC Chip Low angle light emitting 600x600

Lauro Rizzatti offers Semiwiki readers a two-part series on why three kinds of hardware-assisted verification engines are now a must have for semiconductor designs continues today. His interview below with Juergen Jaeger, Prototyping Product Strategy Director in the Scalable Verification Solution division at Siemens EDA,… Read More


Why China hates CHIPS

Why China hates CHIPS
by Craig Addison on 09-05-2022 at 6:00 am

Joe Bidden CHIPS Act 2022

The CHIPS and Science Act has its fair share of critics, with detractors calling it corporate welfare for “losers” like Intel, or lacking guardrails to prevent companies making legacy chips in China.

One of the most vocal opponents of the act has been China’s communist-ruled government.

CHIPS – an acronym for Creating Helpful … Read More


MAB: The Future of Radio is Here

MAB: The Future of Radio is Here
by Roger C. Lanctot on 09-04-2022 at 6:00 am

MAB The Future of Radio is Here 1

Good story telling is what helps drive change, engage consumers, and define progress. Steve Newberry, CEO of Quu, is a master of the craft.

He told two stories, in particular, at the Michigan Association of Broadcasters event last week in Traverse City, Mich. The first story was to simply note for the broadcasters in attendance

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Podcast EP105: Cadence STA Strategy and Capabilities, Today and Tomorrow with Brandon Bautz

Podcast EP105: Cadence STA Strategy and Capabilities, Today and Tomorrow with Brandon Bautz
by Daniel Nenni on 09-02-2022 at 10:00 am

Dan is joined by Brandon Bautz, senior group director of product management responsible for silicon signoff and verification product lines in the Cadence Digital & Signoff Group. Brandon has more than 20 years of experience in chip design and the EDA industry and has been at Cadence for over 10 years.

Dan explores the current… Read More


The Semiconductor Cycle Snowballs Down the Food Chain – Gravitational Cognizance

The Semiconductor Cycle Snowballs Down the Food Chain – Gravitational Cognizance
by Robert Maire on 09-02-2022 at 6:00 am

Wiley Coyote Semiconductor Crash 2022

-Where are we in the chip cycle? Why is it different this time?
-No one rings a bell to indicate the top or bottom of a cycle
-Could the lack of self-awareness lead to a worse downturn?
-Who will weather the cycle better & come out on top

Gravitational Cognizance
“A cartoon character will not fall until they realize they should

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Resilient Supply Chains a Must for Electronic Systems

Resilient Supply Chains a Must for Electronic Systems
by Dave Bursky on 09-01-2022 at 10:00 am

three phase approach to supply chain resilence

The last few years have seen multiple disruptions in the supply chain in many industries. One of the key technologies that many fingers have pointed to is the semiconductor technology.  As products in all industries become more electronics based, semiconductors play a key role since no end system could function today without … Read More


Coherency in Heterogeneous Designs

Coherency in Heterogeneous Designs
by Bernard Murphy on 09-01-2022 at 6:00 am

Ncore application

Ever wonder why coherent networks are needed beyond server design? The value of cache coherence in a multi-core or many-core server is now well understood. Software developers want to write multi-threaded programs for such systems and expect well-defined behavior when accessing common memory locations. They reasonably expect… Read More


Podcast EP104: Enabling Future Innovation with GBT Technologies

Podcast EP104: Enabling Future Innovation with GBT Technologies
by Daniel Nenni on 08-31-2022 at 10:00 am

Dan is joined by Dr. Danny Rittman, CTO of GBT Technologies. Danny has an extensive background in the R&D space and has been working for companies such as Intel, IBM, and Qualcomm. He has spent most of his career researching and inventing processor chips, as well as paving the way for futuristic AI software programs that can be… Read More


Five Key Workflows For 3D IC Packaging Success

Five Key Workflows For 3D IC Packaging Success
by Kalar Rajendiran on 08-31-2022 at 6:00 am

3D IC design workflows

An earlier blog started with the topic of delivering 3D IC innovations faster. The blog covered the following foundational enablers for successful heterogeneous 3D IC implementation.

  • System Co-Optimization (STCO) approach
  • Transition from design-based to systems-based optimization
  • Expanding the supply chain and tool
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WEBINAR: Intel Achieving the Best Verifiable QoR using Formal Equivalence Verification for PPA-Centric Designs

WEBINAR: Intel Achieving the Best Verifiable QoR using Formal Equivalence Verification for PPA-Centric Designs
by Synopsys on 08-30-2022 at 10:00 am

Synopsys Fusion Compiler

Synopsys Fusion Compiler offers advanced optimizations to achieve the best PPA (power, performance, area) on today’s high-performance cores and interconnect designs. However, advanced transformation techniques available in synthesis such as retiming, multi-bit registers, advanced datapath optimizations, etc. are

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