-Semi Equip go from bad to worse as TSMC cuts capex
-Numbers will be slashed for December quarter
-So far just a handful of exceptions to blockade but temporary
-China’s response could be very ugly
Fast motion train wreck
Just when some people thought that Fridays department of commerce announcement couldn’t get worse,… Read More
Dan is joined by Mattew Burns, Matt develops go-to-market strategies for Samtec’s Silicon to Silicon solutions. Over the course of 20+ years, he has been a leader in design, technical sales and marketing in the telecommunications, medical and electronic components industries.
Dan and Matt discuss the recent AI Hardware Summit… Read More
One of my favorite events is just around the corner and that is the TSMC OIP Ecosystem Forum and it’s at my favorite Silicon Valley venue the Santa Clara Convention Center. Nobody knows more about the inner workings of the ecosystem than TSMC so this is the premier semiconductor collaboration event, absolutely.
In my 40 years as a … Read More
This year is proving to be a momentous one for U.S. semiconductor manufacturing. During a global chip shortage and record inflation, President Biden signed into effect the CHIPS and Science Act – which so far is the greatest boon to U.S. semiconductor manufacturing in history, with $52 billion in subsidies for chip manufacturers… Read More
The tremendous growth in edge devices has focused the spotlight on Edge-AI processing for low latency, low power and low-DDR bandwidth compute needs. Many of these Edge-AI applications depend on effective and efficient processing of image and video streams which in turn relies on computer vision technology. In early September,… Read More
-Commerce Dept drops a 100 page nuke on the Semi industry
-Many words but not a lot of clarity on exact impact
-Implementation & interpretation will be key to quantify impact
-It’s all bad, just a question of how bad
China is the industry’s biggest customer
We all know that China uses most of the world’s semiconductors… Read More
Dan is joined by Brandon Bautz, Sr. Group Director of Product Management, responsible for the Cadence silicon signoff and verification product lines in the Digital & Signoff Group.
Dan and Brandon explore the substantial challenges faced by design teams needing to perform full-chip signoff at an accelerated pace for advanced… Read More
When it comes to electronic design automation (EDA), there are two aspects to this technologically challenging and highly competitive field. First, there is the task of designing very complex chips for which a full suite of various software tools are needed. Then there is the task of managing extremely complex EDA workflows and… Read More
On 2021, a British/Polish firm known as Walletmor announced that it had become the first company to sell implantable payment microchips to everyday consumers. While the first microchip was implanted into a human way back in 1998, says the BBC News—so long ago it might as well be the Dark Ages in the world of computing—it is only recently… Read More
In spite of increasing usage of EUV lithography, stochastic defects have not gone away. What’s becoming clearer is that EUV doses must be managed to minimize the impact from such defects. The 2022 edition of the International Roadmap for Devices and Systems has updated its Lithography portion [1]. An upward trend with decreasing… Read More
Should Intel be Split in Half?