When it comes to competing with Elon Musk’s Tesla the automotive industry is, in many ways, its own worst enemy. For more than two decades the auto industry – in the U.S. and E.U. – has struggled to bring vehicle-to-vehicle communication technology to market – first as dedicated short range communications… Read More



Bleak Year for Semiconductors
The global semiconductor market in 2022 was $573.5 billion, according to WSTS. 2022 was up 3.2% from 2021, a significant slowdown from 26.2% growth in 2021. We at Semiconductor Intelligence track semiconductor market forecasts and award a virtual prize for the most accurate forecast for the year. The criteria are a forecast publicly… Read More
Exponential Innovation: HFSS
The old adage: “If it ain’t broke, don’t fix it,” is as offensive to innovators as it is to grammarians. Just because something works well, doesn’t mean it cannot work better. As times change and technology advances, you either move forward or get left behind.
If you haven’t upgraded to the latest Ansys HFSS electromagnetic simulation… Read More
Hardware Security in Medical Devices has not been a Priority — But it Should Be
Rapid advances in medical technology prolong patients’ lives and provide them with a higher standard of living than years past. But the increased interconnectivity of those devices and their dependence on wired and wireless networks leave them susceptible to cyberattacks that could have severe consequences.
Whether… Read More
AMAT- Flat is better than down-Trailing tool strength offsets memory- backlog up
-Strength in trailing tools offsets weak memory resulting in flat
-Order book very volatile but backlog surprisingly still grew
-Trailing edge VS Leading edge = 50/50 – Foundry/logic over 2/3
-Not nearly as bad as Lam but not as good as ASML
AMAT posts good quarter & guide – Flat for three quarters
Applied Materials… Read More
IEDM 2023 – 2D Materials – Intel and TSMC
Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on 2D Materials and TSMC presented 6 papers. Clearly 2D materials are of great interest at least to two of the three leading edge logic companies. Before diving into the papers, some background context is needed.… Read More
Podcast EP144: How Andes Supplies RISC-V Cores to the World with Frankwell Lin
Dan is joined by Frankwell Lin. Frank co-founded Andes Technology in 2005 and served as President from 2006. He became Chairman and CEO in 2021. Under his leadership, Andes is recognized as a top supplier of embedded CPU IP in the semiconductor industry.
Dan explores how Andes became such a strong supplier of RISC-V cores with Frank.… Read More
CEO Interview: Axel Kloth of Abacus
A physicist by training, Axel is used to the need for large-scale compute. He discovered over 30 years ago that scalability of processor performance was paramount for solving any computational problem. That necessitated a new paradigm in computer architecture. At Parimics, SSRLabs and Axiado he was able to show that new thinking… Read More
Speeding up Chiplet-Based Design Through Hardware Emulation
The first chiplets focused summit took place last month. So many accomplished speakers gave keynote talks on what direction should and would the Chiplets ecosystem evolution take. Corigine presented the keynote on what direction hardware emulation should and would evolve for speeding up chiplet- based designs. During a pre-conference… Read More
ML-Based Coverage Acceleration. Innovation in Verification
We looked at another paper on ML-based coverage acceleration back in April 2022. Here is a different angle from IBM. Paul Cunningham (Senior VP/GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas. As always, feedback… Read More
Should Intel be Split in Half?