800x100 Efficient and Robust Memory Verification (2)

CEO Interview: Zeev Collin of Semitech Semiconductor

CEO Interview: Zeev Collin of Semitech Semiconductor
by Daniel Nenni on 08-14-2024 at 10:00 am

Zeev 29

Zeev Collin is a seasoned technology executive and serial entrepreneur with over 25 years of experience in executive management across international semiconductor companies and startups. Prior to co-founding Semitech, Zeev co-founded and successfully exited two ventures focused on vehicle and trailer tracking devices.… Read More


WEBINAR: Silicon Area Matters!

WEBINAR: Silicon Area Matters!
by Daniel Nenni on 08-14-2024 at 8:00 am

SemiWiki Flex Logix Webinar

When designing IP for system-on-chip (SoC) and application-specific integrated circuit (ASIC) implementations, IP designers strive for perfection. Optimal engineering often yields the smallest die area, thereby reducing both cost and power consumption while maximizing performance.

Similarly, when incorporating embedded… Read More


First third-party ISO/SAE 21434-certified IP product for automotive cybersecurity

First third-party ISO/SAE 21434-certified IP product for automotive cybersecurity
by Don Dingee on 08-14-2024 at 6:00 am

ISO/SAE 21434 and UNECE WP.29 R155

Increased processing and connectivity in automobiles are cranking up the priority for advanced cybersecurity steps to keep roads safe. Electronic vehicle interfaces, including 5G/6G, Bluetooth, Wi-Fi, GPS, USB, CAN, and others, offer convenience features for drivers and passengers, but open numerous attack vectors for… Read More


Circuit Simulation Update from Empyrean at #61DAC

Circuit Simulation Update from Empyrean at #61DAC
by Daniel Payne on 08-13-2024 at 10:00 am

Empyrean SPICE min

A familiar face in EDA, Greg Lebsack met with me in the Empyrean booth at DAC this year on opening day to provide an update on what’s new. I first met Greg when he was at Tanner EDA, then Mentor and Siemens EDA, so he really knows our industry quite well. The company was a Silver level sponsor of DAC this year, and Empyrean offers tools for… Read More


Why Glass Substrates?

Why Glass Substrates?
by Sharada Yeluri on 08-13-2024 at 6:00 am

Intel Glass Substrates

The demand for high-performance and sustainable computing and networking silicon for AI has undoubtedly increased R&D dollars and the pace of innovation in semiconductor technology. With Moore’s Law slowing down at the chip level, there is a desire to pack as many chiplets as possible inside ASIC packages and get … Read More


PieceMakers HBLL RAM: The Future of AI DRAM

PieceMakers HBLL RAM: The Future of AI DRAM
by Joe Ting on 08-12-2024 at 6:00 am

PieceMaker Memory

PieceMakers, a fabless DRAM product company, is making waves in the AI industry with the introduction of a new DRAM family that promises to outperform traditional High Bandwidth Memory (HBM). The launch event featured industry experts, including a representative from Samsung, highlighting the significance of this innovation.… Read More


A Post-AI-ROI-Panic Overview of the Data Center Processing Market

A Post-AI-ROI-Panic Overview of the Data Center Processing Market
by Claus Aasholm on 08-11-2024 at 8:00 am

Datacenter Supply Chain 2024

With all the Q2-24 results delivered, it is time to remove the clouds of euphoria and panic, ignore the performance claims and the bugs, and analyse the Data Center business, including examining the supply chain up and downstream. It is time to find out if the AI boom in semiconductors is still alive.

We begin the analysis with the … Read More


Podcast EP240: Challenges and Strategies to Address New Embedded Memory Architectures with Mark Han

Podcast EP240: Challenges and Strategies to Address New Embedded Memory Architectures with Mark Han
by Daniel Nenni on 08-09-2024 at 10:00 am

Dan is joined by Dr. Mark Han, Vice President of R&D Engineering for Circuit Simulation at Synopsys. Mark leads a team of over 300 engineers in developing cutting-edge advanced circuit simulation and transistor-level sign-off products, including characterization and static timing analysis. With 27 years of industry … Read More


CEO Interview: Yogish Kode of Glide Systems

CEO Interview: Yogish Kode of Glide Systems
by Daniel Nenni on 08-09-2024 at 6:00 am

Yogish Kode

Yogish Kode is a senior solutions architect with substantial experience in product lifecycle management for over 20 years. His focus has been on semiconductor PLM and IP management. Prior to founding Glide Systems, he was a global solutions architect at Dassault Systèmes, an IT lead at Xilinx, and a senior programmer/analyst… Read More


Design Automation Conference #61 Results

Design Automation Conference #61 Results
by Daniel Nenni on 08-08-2024 at 10:00 am

IMG 3273

This was my 40th Design Automation Conference and based on my follow-up conversations inside the semiconductor ecosystem it did not disappoint. The gauge I use for exhibitors is “qualified customer engagements” that may result in the sale of their products. This DAC was the best for that metric since the pandemic, absolutely.… Read More