Koji Motomori is a seasoned business leader and technologist with 30+ years of experience in semiconductors, AI, embedded systems, data centers, mobile, and memory solutions, backed by an engineering background. Over 26 years at Intel, he drove strategic growth initiatives, securing $2B+ in contracts with OEMs and partners.… Read More




Video EP3: A Discussion of Challenges and Strategies for Heterogeneous 3D Integration with Anna Fontanelli
In this episode of the Semiconductor Insiders video series, Dan is joined by Anna Fontanelli, founder and CEO of MZ Technologies. Anna explains some of the substantial challenges associated with heterogeneous 3D integration. Dan then begins to explore some of the capabilities of GenioEVO, the first integrated chiplet/package… Read More
CEO Interview with Richard Hegberg of Caspia Technologies
Rick has a long and diverse career in the semiconductor industry. He began as VP of sales at Lucent Microelectronics. He has held executive roles at several high-profile companies and participated in several acquisitions along the way. These include NetApp, SanDisk/WD, Atheros/Qualcomm, Numonyx/Micron, ATI/AMD, and VLSI… Read More
TSMC Describes Technology Innovation Beyond A14
The inaugural event for the 2025 TSMC Technology Symposium recently concluded in Santa Clara, California. This will be followed by events around the world over the next two months. We have summarized information from this event regarding process technology innovation and advanced packaging innovation. Overall, the A14 process… Read More
SNUG 2025: A Watershed Moment for EDA – Part 2
At this year’s SNUG (Synopsys Users Group) conference, Richard Ho, Head of Hardware, OpenAI, delivered the second keynote, titled “Scaling Compute for the Age of Intelligence.” In his presentation, Richard guided the audience through the transformative trends and implications of the intelligence era now unfolding before… Read More
Emerging NVM Technologies: ReRAM Gains Visibility in 2024 Industry Survey
A recent survey of more than 120 anonymous semiconductor professionals offers a grounded view of how the industry is evaluating non-volatile memory (NVM) technologies—and where things may be heading next.
The 2024 NVM Survey, run in late 2024 and promoted through various semiconductor-related platforms and portals including… Read More
Feeding the Beast: The Real Cost of Speculative Execution in AI Data Centers
For decades, speculative execution was a brilliant solution to a fundamental bottleneck: CPUs were fast, but memory access was slow. Rather than wait idly, processors guessed the next instruction or data fetch and executed it ‘just in case.’ Speculative execution traces its lineage back to Robert Tomasulo’s work… Read More
LLMs Raise Game in Assertion Gen. Innovation in Verification
LLMs are already simplifying assertion generation but still depend on human-generated natural language prompts. Can LLMs go further, drawing semantic guidance from the RTL and domain-specific training? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO… Read More
Automotive Functional Safety (FuSa) Challenges
Modern vehicles have become quite sophisticated, like a supercomputer on wheels. They integrate a vast number of electronic components, including thousands of chips, to deliver advanced functionalities ranging from infotainment to critical safety systems. This increasing complexity necessitates a robust approach to … Read More
Scaling AI Infrastructure with Next-Gen Interconnects
At the recent IPSoC Conference in Silicon Valley, Aparna Tarde gave a talk on the importance of Next-Gen Interconnects to scale AI infrastructure. Aparna is a Sr. Technical Product Manager at Synopsys. A synthesis of the salient points from her talk follows.
The rapid advancement of artificial intelligence (AI) is fundamentally… Read More
Facing the Quantum Nature of EUV Lithography