As RISC-V adoption accelerates across the semiconductor industry, so do the concerns about hardware security vulnerabilities that arise from its open and highly customizable nature. From hardware to firmware and operating systems, every layer of a system-on-chip (SoC) design must be scrutinized for security risks. Unlike… Read More
The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node SurvivalThe philosophy of relying on a single, unified…Read More
CTO Interview with Taylor Barton of Certus SemiconductorTaylor Barton is a Lead Analog/Mixed-Signal and I/O…Read More
Generating Chip Subsystems Automatically: A New Answer to Manage Chip Design Complexity By Defacto Staff Today’s chips are no longer…Read More
Reimagining 3D IC Design: From Architecture to SignoffBy Keith Felton, Andras Vass-Varnai and Todd Burkholder,…Read More
GSA Honors Sanjay Mehrotra as Memory Takes Center Stage in ComputingThe Global Semiconductor Alliance will present Micron Technology…Read MoreMetal fill extraction: Breaking the speed-accuracy tradeoff
By Shehab Ashraf
As semiconductor technology scales and device complexity increases, accurately modeling the parasitic effects of metal fill has become critical for circuit performance, power integrity, and reliability. Metal fill is a crucial part of the manufacturing process, ensuring uniform layer density, improving… Read More
How Arteris is Revolutionizing SoC Design with Smart NoC IP
Recently, Design & Reuse held its IP-SoC Days event at the Hyatt Regency in Santa Clara. Advanced IP drives a lot of the innovation we are seeing in chip design. This event provides a venue for IP providers to highlight the latest products and services and share a vision of the future. IP consumers are anxious to hear about all the… Read More
CEO Interview with Ido Bukspan of Pliops
Prior to becoming CEO of Pliops in 2023, Ido Bukspan was the senior vice president of the Chip Design Group at NVIDIA and one of the leaders at Mellanox before it was acquired by NVIDIA for nearly $7 billion.
Tell us about your company.
Pliops accelerates and amplifies the performance and scalability of global GenAI infrastructure,… Read More
CEO Interview with Roger Cummings of PEAK:AIO
Roger Cummings is the CEO of PEAK:AIO, a company at the forefront of enabling enterprise organizations to scale, govern, and secure their AI and HPC applications. Under Roger’s leadership, PEAK:AIO has increased its traction and market presence in delivering cutting-edge software-defined data solutions that transform commodity… Read More
Video EP4: A Deeper Look at Advanced Packaging & Multi-Die Design Challenges with Anna Fontanelli
In this episode of the Semiconductor Insiders video series, Dan is once again joined by Anna Fontanelli, founder and CEO of MZ Technologies. In this discussion, more details of the challenges presented by advanced packaging and multi-die design are explored. Anna provides details of what’s involved in architectural … Read More
Analog Bits Steals the Show with Working IP on TSMC 3nm and 2nm and a New Design Strategy
The TSMC Technology Symposium recently kicked off in Santa Clara, with a series of events scheduled around the world. This event showcases the latest TSMC technology. It is also an opportunity for TSMC’s vast ecosystem to demonstrate commercial application on TSMC’s technology. There is a lot to unpack at an event like this. There… Read More
Podcast EP286: The Significant Impact of Ambient Scientific Technology on AI Deployment with GP Singh
Dan is joined by GP Singh, CEO of Ambient Scientific. With over 20 years of experience, GP has played a pivotal role in shaping the industry, driving 50+ chip tapeouts, including game-changing advancements at FinFET technology nodes. Now, as the CEO of Ambient Scientific, GP brings together hands-on engineering expertise and… Read More
RISC-V Virtualization and the Complexity of MMUs
In the early days of RISC-V adoption, applications were microcontroller-centric with no need for virtualization support. But horizons expanded and now RISC-V is appearing in application processors, very much needing to be able to virtualize multiple apps concurrently. Take another step forward to datacenter servers running… Read More
Beyond the Memory Wall: Unleashing Bandwidth and Crushing Latency
VSORA AI Processor Raises $46 Million to Fast-Track Silicon Development
We stand on the cusp of an era defined by ubiquitous intelligence—a stone’s throw from a tidal wave of AI-powered products underpinned by next-generation silicon. Realizing that future demands nothing less than a fundamental rethink of how we design semiconductors… Read More


The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival