Geoffrey Rodgers spent most of his career at the intersection of semiconductor technology and go-to-market execution, with a focus on scaling businesses and bringing complex solutions to market. He previously led the Analog Go-To-Market motion at Synopsys following the acquisition of Analog Design Automation and held leadership… Read More
Broadcom Told the Truth. The Market Hasn’t Heard the Rest of It Yet.Hock Tan and his CFO Kirsten Spears logged…Read More
CEO Interview with Chuck Gershman of Owl Autonomous ImagingChuck Gershman is the CEO and co-founder of…Read More
CEO Interview with Daniel Schall of Black SemiconductorDr. Daniel Schall is CEO and Co-Founder of…Read More
Alchip Accelerates on AI ASIC DemandAlchip Technologies reported improved financial results for the…Read More
Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys ToolsAs advanced packaging becomes a critical enabler for…Read MorePodcast EP344: An Overview of the Upcoming Sensors Converge Event with David Drain
Daniel is joined by David Drain, show director for Questex’s Sensors Converge and Broadband Nation Expo, where he leads strategy, content, and industry engagement for two of the company’s flagship technology events. Prior to joining Questex, David spent more than 15 years with Networld Media Group, most recently as senior vice… Read More
Dr. L.C. Lu on TSMC Advanced Technology Design Solutions
L.C. leads efforts in design enablement, ensuring that the company can meet the diverse and evolving requirements of its global customer base. Prior to this, he headed the Design and Technology Platform organization starting in 2018.
Since joining TSMC in 2000, Dr. Lu has held multiple leadership positions in design services.… Read More
Solving the EDA tool fragmentation crisis
By Samar Abd El-Hady and Wael ElManhawy
Design teams today face an uncomfortable truth: the specialized tools they need to verify modern ICs can’t reliably share the same design data. As geometries shrink below five nanometers and designs incorporate billions of transistors across multiple dies, no single Electronic… Read More
Dr. Y.J. Mii on TSMC Technology Leadership in 2026
Dr. Y.J. Mii joined TSMC in 1994 as a manager at Fab 3 before moving into the company’s research and development organization in 2001. He was appointed Vice President of R&D in 2011 and later advanced to Senior Vice President in November 2016.
Over more than 20 years at TSMC, Dr. Mii has played a central role in advancing and manufacturing… Read More
Advanced Microelectronics Paving the Way for 6G with Alphacore
The world stands at the threshold of a new era in wireless communication as research communities, standards bodies, and technology companies begin shaping what will become sixth generation mobile networks. While fifth generation systems are still expanding across global markets, attention has already shifted toward defining… Read More
Enabling Next-Generation AI Through Advanced Packaging and 3D Fabric Integration
The rapid rise of artificial intelligence is fundamentally reshaping computing architectures. As AI models scale toward trillions of parameters, traditional approaches to performance improvement are no longer sufficient. Instead, the industry is entering a new era where system-level innovation, advanced packaging, … Read More
WAVE-N Specialized Video Processing NPU for Edge AI Systems
The rapid growth of AI applications in edge devices has created a strong demand for specialized hardware capable of performing high-performance neural network inference under strict power and latency constraints. Traditional CPUs and GPUs often struggle to meet the efficiency requirements of embedded and mobile systems.… Read More
Complex PCB signoff challenges
Many complex PCB designs have high data-rate signals like USB, PCIe, DDR and HDMI which call for more thorough verification methods to ensure compliance plus mitigate any signal integrity, power integrity and EMI/EMC issues. Siemens has a methodology that uses automated rule-based electrical verification with an EDA tool,… Read More
Dr. Cliff Hou and the TSMC N2 Process Technology
Before assuming his current position, Dr. Hou held several key leadership roles. He served as Vice President of Design and Technology Platform from 2011 to 2018, and later as Vice President of Technology Development starting in August 2018. Earlier in his career, from 1997 to 2007, he established TSMC’s technology design kit


The Memory Sector Is Becoming One of the Main Beneficiaries of the AI Boom