Jr. Engineer of Thermal / Cooling
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Website Alchip
Work content
1. Thermal/cooling methodology development
2. Thermal analysis, optimization and sign-off for SoC-PKG-PCB/3D-IC/interposer co-design.
3. CFD model generation and optimization.
4. Providing thermal design guidelines for SoC/ PKG/PCB/3D-IC/interposer design.
5. Providing thermal/cooling recommendations on pre-sales PKG/PCB/3D-IC proposals.
Requirements
Education/License:
1. Master of Science is preferred with major of mechanical engineering / electrical / electronic engineering / aerospace engineering related.
Working Experience:
1. 1+ years of thermal analysis experience is a bonus.
2. 3D-IC/ Package / PCB development experience is a bonus.
Professional Knowledge:
1. Experience of System thermal analysis is preferred.
2. Familiar with CFD software, such as ANSYS / FloEFD/ StarCCM/ Flotherm/ Cadence.
3. Perform CFD analysis and evaluate thermal/ air flow solution.
Other Special Requirement:
1. Good communication of English.
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