The Advanced Silicon Packaging Development department has an Internship for a motivatedElectrical/Electronic/Computer Engineering or Physics Graduate student.In this position, you will support the Advanced Silicon Packaging department in the development of newpackaging technologies (silicon interposers, through silicon via and antenna integrated packages).The position is based in Malta, New York.Essential responsibilities.Develop models for Silicon interposers, through silicon via (TSV) and package integrated Antenna Design transmission lines to meet characteristic impedance, return loss and insertion loss targets
Develop circuit models for RF signal chains (transmission lines, amplifiers, DC blocking capacitors andbias T) Analyze DC IR drop in silicon interposers and packages.
Graduate student in Electrical/Electronic/Computer Engineering or Physics (M.S or PhD)
Experience with ANSYS High Frequency Structure Simulator (HFSS)
Knowledge of transmission lines, S parameters and Smith charts
Course work in Electromagnetics and Circuit analysis
Experience with Cadence software tools (Allegro, Sigrity, PowerDC)
Experience with Keysight Advanced Design System (ADS), Simulation Program with Integrated Circuit Emphasis (SPICE)
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To view the job application please visit gfoundries.taleo.net.