Intern- TEQ ADV SI PACKAGING

The Advanced Silicon Packaging Development department has an Internship for a motivatedElectrical/Electronic/Computer Engineering or Physics Graduate student.In this position, you will support the Advanced Silicon Packaging department in the development of newpackaging technologies (silicon interposers, through silicon via and antenna integrated packages).The position is based in Malta, New York.Essential responsibilities.Develop models for Silicon interposers, through silicon via (TSV) and package integrated Antenna Design transmission lines to meet characteristic impedance, return loss and insertion loss targets

Develop circuit models for RF signal chains (transmission lines, amplifiers, DC blocking capacitors andbias T) Analyze DC IR drop in silicon interposers and packages.

 Required qualifications

• Graduate student in Electrical/Electronic/Computer Engineering or Physics (M.S or PhD)
• Experience with ANSYS High Frequency Structure Simulator (HFSS)
• Knowledge of transmission lines, S parameters and Smith charts
• Course work in Electromagnetics and Circuit analysis

Preferred qualifications

• Experience with Cadence software tools (Allegro, Sigrity, PowerDC)
• Experience with Keysight Advanced Design System (ADS), Simulation Program with Integrated Circuit Emphasis (SPICE)