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Could not resist adding few words:
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- Lithography is always made to be the wafer fab capacity bottleneck because it is the most expensive
- It just means that when rounding up and down, lithography may see more rounding down and other areas rounding up
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- As soon as the fab starts running, the...
There has always been a large difference in lithography between tsmc foundry and Intel microprocessor. The number of EUV layers depends of the design rules.
To go back to the original question: of course they do! And it is quite dramatic. The key reasons are yield improvements, productivity improvements and depreciation of the tools