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For lower nodes like 10nm and 7nm , foundries are using SADP process for processing of Mx layers . I would like to know what is the approach
using by tsmc/samsung/intel for these SADP layers ?
The various approaches are 1. Traditional SID-SADP (Block Mask) 2. Mandrel Fill/Cut Mask SID-SADP...
what is the reason behind poly (transistor gate) orientation check in advanced process nodes ?
Basically the check is like all the standard cells , memories , IP's need to have same poly orientation ( either horizantal or vertical ) .
why not to use both orientations ?
Hi
In 22nm fdsoi technology , there were some design rules like VT spacing between SVT and LVT , SVT and HVT std cells
so it is not possible to allow mixed VT in a chip .
I want to know what was the reason for this ? is there any limitation from Manufacturing point of...