The challenges before semiconductor fabs are expansive and evolving. As the size of chips shrinks from nanometers to eventually angstroms, the complexity of the manufacturing process increases in response. To …
As AI models’ demand for computational power escalates at an unprecedented rate, the demand for high-speed, efficient, and low-power solutions has never been greater. This Synopsys webinar will explore the …
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s …
Synopsys Webinar | Thursday, August 22, 2024 | 10:00 - 10:40 a.m. PT Join us for an exclusive Synopsys Cloud webinar highlighting the benefits of license management automation. Synopsys Cloud …
Continue reading "Webinar: Unlock Seamless EDA License Management On-Prem or In the Cloud"
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s …
Power-Efficient RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the challenge of developing more powerful, yet more energy-efficient devices. The processors used in these applications must be efficient to deliver high levels of performance within …
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s …
Wednesday, September 18, 2024 | 10 a.m. PDT Migrating analog designs across process nodes can be a complex and time-consuming challenge. In this webinar, Credo will share its experience using …
Continue reading "Webinar: How to Migrate an Analog Design Like a Pro"
Abstract: A successful multi-die design begins at the architecture exploration level. However, the architecture challenges are exacerbated for multi-die designs as performance and power need to be optimized across multiple heterogeneous and homogeneous dies. Disaggregating IPs based on workload demands, selecting the right interface, and accurately predicting power and performance indicators are among some of …
