The event that brings together the most experts from Romania in design and simulation High Performance Engineering Solutions 2024 will take place on April 4-5, in Brasov . High Performance Engineering Solutions 2024, event dedicated to …
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Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate temperature range. Avoiding excessive heat buildup helps ensure …
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Ansys Semiconductor Manufacturing Webinar Series: Part 1 of 3. Join us on Thursday, April 25th for an in-depth view of multiphysics simulation in the semiconductor fabrication process. Learn more about the webinar series! TIME: THURSDAY, APRIL 25TH 11 AM EASTERN TIME Venue: Virtual Overview Accurate design and optimization of the semiconductor fabrication process/equipment for yield improvements …
Join Ansys on May 30, 2024, at the Brookstreet Hotel in Ottawa for the Ansys Canada Innovation Conference. This one-day event will blend Ansys expert-led technical sessions, highlighting workflows and …
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Join us for our in-person seminar, where we delve into the dynamic challenges facing the energy, offshore, and ship industries. We will show how to harness the power of Ansys …
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