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Webinar: Thermal Solutions for Electronics Design
April 24 @ 8:00 AM - 9:00 AM
Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate temperature range. Avoiding excessive heat buildup helps ensure consistent performance across a wide range of environmental and operating conditions. As the evolution of modern electronics require smaller footprints with higher power requirements, integrating thermal analysis early in the design process will remain crucial to ensure products meet the demands for efficiency and reliability.
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