platform

This webinar outlines the power integrity, thermal integrity, and signal integrity difficulties in 3D-IC design. TIME: NOVEMBER 3, 2022 11 AM EDT / 3 PM GMT / 8:30 PM IST REGISTER HERE About this Webinar This webinar introduces the Multiphysics requirements to meet performance, integrity, and reliability expectations for 3DICs. Beyond ‘golden solver’ requirements for …

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