June 3, 2020 11:00 AM EDT / 3:00 PM GDT Venue: Online In the electronics industry, the quality and reliability of a printed circuit board (PCB) is highly dependent upon the capabilities of the PCB fabrication suppliers. As such, the design engineer needs to understand the processes involved in designing and fabricating circuit boards in …
As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also temperature-dependent, making dynamic and static IR drop analysis crucial in addressing the performance and capacity challenges of such designs. …
Sponsored by: Cadence Presented by: Nitin Bhagwath, Director of Product Management Event Duration: 60 minutes Abstract: Signal integrity/power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards. Faster signoff of designs can be achieved by uncovering signal SI/PI issues early in the design process. This webinar will highlight three key issues engineers need to …
