Webinar: The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

Online

November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET (A recording will be sent after the live event to all registrants) The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.1 As the semiconductor industry …

Seventh Annual Symposium on Heterogeneous Integration Roadmap and Annual Meeting

Samsung Electronics Campus 3655 N First Street, San Jose, CA, United States

IEEE vTools Events is more than just a place to report past meeting activity. It is an event management tool that enables IEEE Sections, Subsections, Chapters, Affinity Groups and Student Branches to schedule, promote and report (L31) IEEE meetings and events. vTools Events also offers event registration which, if setup, will automatically send the proceeds …