The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip …
Presented by Mark Quartermain, Director IoT Technology Management & Matthias Hertel, Senior Manager - Embedded Tools Integration About this talk The ability to add greater levels of intelligence to endpoint devices opens up a huge variety of new use cases. However, achieving the required levels of DSP and ML compute performance in these devices - …
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The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging …
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