Webinar: Thermal Solutions for Electronics Design

Online

Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate temperature range. Avoiding excessive heat buildup helps ensure …

Webinar: Automating the Integration Workflow with IP Centric Design

Online

(Work email required for verified registration) During a project, subsystem and full-chip integration plays a crucial role. Integration can be particularly challenging on large SoCs with distributed teams due to complexity of the integration process, multi-site infrastructure issues, as well as the need to collaborate across multiple time zones. Often, integrators must integrate design blocks …

DVCon Japan 2024

Shinagawa, Tokyo, Japan Shinagawa, Tokyo, Japan

The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated …