Webinar: High-Fidelity and Numerically Robust Modeling of Wide-Bandgap Power MOSFETs with Saber

Online

The adoption of wide-bandgap power MOSFETs (SiC and GaN) is growing in power electronic applications for consumer electronics, automotive, and renewable energy. Successful implementation of simulation in system design requires high-fidelity, numerically robust, and compact power MOSFET models. The Saber circuit simulation environment offers a proven and mature solution with a dedicated tool that allows …

Keysight EDA Connect Tour: Burlington

Eddie V's Restaurant 50 South Avenue, Burlington, MA, United States

As AI is redefining communication and connectivity, your ability to design, simulate, and test — using an intelligent and automated workflow — is what will set you apart. Join us for a half-day event that brings together top industry experts and innovators to explore modern RF circuit and system design, including advanced topics like phased …

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Gartner Data & Analytics Summit 2024

Tokyo, Japan Tokyo, Japan

Generating Value Together: From Data to AI to Collective Intelligence Welcome to the era of collective intelligence. Now is the time to mobilize the synergy of human expertise, data, analytics and AI to optimize business value and outcomes by making the best connected decisions. Fundamentals matter. We are always building and updating our technology, data …

CadenceCONNECT: Tech Days Europe 2024 – Milan

H2C Hotel Milanofiori Via Roggia Bartolomea, 5, Assago, Italy

Date: Tuesday, May 21, 2024 Venue: H2C Hotel Milanofiori Location: Via Roggia Bartolomea, 5, 20057 Assago MI, Italy Parking: There is a car park on-site that is free of charge. Spaces cannot be guaranteed as it is used by all hotel guests. You will receive further information in your registration confirmation email. Analog, RF, and Mixed-Signal IC Design Learn …

Synopsys & AMD Webinar – Final Frontier: The Next Generation of 3DIC Interposer/InFO Design

Online

In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while demolishing limitations on speed and capacity for our highest tiers of compute. But for all the adulation we heap upon the 3DIC paradigm, we seemingly …