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Abstract: A successful multi-die design begins at the architecture exploration level. However, the architecture challenges are exacerbated for multi-die designs as performance and power need to be optimized across multiple heterogeneous and homogeneous dies. Disaggregating IPs based on workload demands, selecting the right interface, and accurately predicting power and performance indicators are among some of …
Join Ansys Optics Manager of Product Management, Tom Pickering, and Senior Manager of Optical Assemblies and Technology, Katie Schwertz, for a comprehensive webinar on the design process for optical assemblies, focusing on requirements development, feasibility studies, preliminary, and critical design stages. TIME: September 20, 2024 Session ONE: 9:00 am EDT Session TWO: 2:00 pm EDT …
Paris Expo Porte de Versailles
1 Pl. de la Prte de Versailles, Paris, France
About The European Microwave Association (EuMA) is an international non-profit association with a scientific, educational and technical purpose. The aim of the Association is to develop in an interdisciplinary way, …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating …
ECOC Exhibition 2024 travels to Frankfurt in Germany. Meet with more than 300 companies and over 6000 colleagues, peers and contacts over the three days. Find out what you can expect at ECOC Exhibition 2024 and read the highlights from the 2023 event which took place in Glasgow in October MARKET FOCUS Now in it’s …
SEMI HQ
673 S Milpitas Blvd., Milpitas, CA, United States
Join us for a 2-day deep dive into the expanding world of Digital Twin (DT) technology in the semiconductor realm. Understand its potential challenges and opportunities and discover its transformative power in enhancing operational productivity and quality. Calling all DT developers and end-users: collaborate, learn, and pave the way for DT's integration into manufacturing! SEMICONDUCTOR …
We will discuss the findings of a joint survey conducted by Hyperion Research, Intel, and Ansys on Total Cost of Ownership (TCO) models utilized for both on-premises and cloud-based HPC resources during this upcoming webinar. TIME: September 24, 2024 11:00 AM EDT Venue: Virtual Overview In this webinar, we will discuss the findings of a …
Primarius NanoSpice™ Series boosts SRAM design accuracy and performance with its powerful suite of tools. Featuring competitive performance, a circuit-type-driven intuitive usage model, and comprehensive capabilities. These solutions deliver high-precision simulations for SRAM blocks, critical paths, and full macro cases covering timing, constraints, and power. Equipped with SPICE and Fast SPICE engines, the solutions effectively …
September 17 and 24, 2024, 15:00 - 16:00 (CEST) | Join the webinar live or watch it later on demand Join our engaging webinar series on blue GIS technology, tailored …
In this webinar, we'll showcase how advanced engineering analytics and materials intelligence can optimize your design processes for sustainability. Discover how to enhance product development by reducing environmental impacts and …
The Westin San Jose
302 S Market St, San Jose, CA, United States
WELCOME TO SISPAD2024 The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development in the area of …
Join us for an informative webinar on Simulation Process and Data Management (SPDM), to learn how Ansys Minerva effectively manages simulation parameters and standardizes use amongst the simulation users within …
