Cadence Cerebrus SaaS on AWS

Join the Cadence and AWS teams for a hands-on workshop and networking event to learn about the Cadence Cerebrus SaaS on AWS. All attendees will receive a giveaway and a chance to win raffle prizes. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization and has powered over 300 tapeouts. …

Accelerate Hydrogen Adoption Using Ansys Simulation: Part 4 – Utilization

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Join us for the final webinar in the four-part series, which offers valuable insight into understanding how simulation can help to optimize gas turbine or furnace efficiency without compromising stability in the operating conditions range, control the NOx emission, predict polarization curves, optimize design, and improve the longevity of fuel cells. Date : April 24,  …

Webinar: Thermal Solutions for Electronics Design

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Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate temperature range. Avoiding excessive heat buildup helps ensure …

Masterclass: Deploying Solido Design Environment AI Workflows on AWS

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Utilizing AWS cloud resources to accelerate variation-aware verification   AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than traditional brute-force methods. With cloud computing made more accessible than before, many teams are considering running design and verification workloads, including Solido Design Environment, on …

Webinar: Signal Integrity for Embedded Computing Applications by Matthew Burns

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Embedded computing developers face new design challenges implementing high-speed protocols like 100 GbE, USB4, PCIe 5.0, DDR4/5, and more. This webinar introduces fundamental signal integrity concepts like insertion loss, return loss, and crosstalk, and relates them to a case study of the connector design for the COM-HPC Module Base Specification Revision 1.2 featuring the new …