2024 Qualcomm Product Security Summit

San Diego, CA San Diego, CA, United States

Presentations from the 2023 Qualcomm Product Security Summit A dark side of UEFI: the same classes of vulnerabilities can affect multiple silicon ecosystems - Alex Matrosov Incident response at Qualcomm: Deriving value from the fires - Scott Bauer The Current and Future of Post-Quantum Cryptography - Reza Azarderakhsh Shooting Cryptographic Fish in a Barrel - Nadia Heninger SyzDescribe: …

EMC Fest 2024

Embassy Suites by Hilton Detroit Livonia Novi 19525 Victor Pkwy, Livonia, MI, United States

2024 Speakers:  Doug Smith and Ken Wyatt Doug Smith Topics: Resonant Structures in PCBs and Systems (Smith) Resonances in electronic systems are responsible for both EMC related failures and system operation problems. We will cover resonances both at the system level, such as PCB to enclosure/chassis resonances, as well as cable, heat sink, enclosure, and unwanted …

Mastering the Porting of Code to RISC-V Architecture

ACL Digital brings to you an exciting webinar series covering all aspects of the RISC-V Ecosystem. Sign up for the exclusive webinar “Porting of Code to RISC-V Architecture,” on May 16, 8.30 a.m. to 9 a.m. PST. While RISC-V presents a simpler alternative to the complex ISAs of the past, its simplicity introduces its own challenges. Gain crucial insights to mitigate challenges and be future-ready.

Webinar: High-Fidelity and Numerically Robust Modeling of Wide-Bandgap Power MOSFETs with Saber

Online

The adoption of wide-bandgap power MOSFETs (SiC and GaN) is growing in power electronic applications for consumer electronics, automotive, and renewable energy. Successful implementation of simulation in system design requires high-fidelity, numerically robust, and compact power MOSFET models. The Saber circuit simulation environment offers a proven and mature solution with a dedicated tool that allows …

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Synopsys & AMD Webinar – Final Frontier: The Next Generation of 3DIC Interposer/InFO Design

Online

In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while demolishing limitations on speed and capacity for our highest tiers of compute. But for all the adulation we heap upon the 3DIC paradigm, we seemingly …