Introducing Ansys Access on Microsoft Azure, a newly released option that streamlines your transition to the cloud. This solution allows a hybrid approach, enabling you to offload heavy workloads to …
Continue reading "Webinar: Transforming Physics Simulations with Ansys and Microsoft"
Ansys introduces Ansys TwinAI, a new addition to Ansys Digital Twin's product portfolio that seamlessly integrates the accuracy of physics models with insights from real-world data powered by cutting-edge AI/ML …
Continue reading "Ansys 2024 R2: Ansys Digital Twin What’s New"
Join this webinar for the latest updates on virtual engineering simulation capabilities in the primary and secondary packaging domain. Showcasing physics-based 3D simulation for performance insight during storage, transportation, and …
Power-Efficient RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the …
We are holding a FREE virtual workshop course for automotive OEM, suppliers and semiconductor industry professionals who want to better understand the software solutions available to help them comply with …
Continue reading "Webinar: ISO26262 FuSa Software Hands-On Workshop for Automotive Value Chain"
ChipQuest Webinar Join us for an exclusive 1-hour webinar designed for HR and Learning & Development professionals in the US semiconductor industry. This event will delve into the pressing workforce …
Continue reading "Webinar: Workforce Armageddon is here. Will your fab survive? Or thrive?"
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating …
6th ACM/IEEE International Symposium on Machine Learning for CAD September 9-11, 2024 in Snowbird, Utah! Important Announcements Student travel grants: We are pleased to offer several travel grants to students. Read more. Journal special issue: Following MLCAD 2024, you will be invited to submit an expanded version. Read more. Open peer review: MLCAD will be using OpenReview starting this year. Read …
The AI Hardware & Edge AI Summit is the ultimate destination for the entire AI and ML ecosystem, with a collaborative mission to train, deploy and scale machine learning systems that are fast, affordable, and efficient. Whether it’s forging new partnerships, staying ahead of the ever-changing semi-conductor landscape, learning how to build, train, and deploy efficient systems, …
Welcome Message On behalf of the DVCon Taiwan 2024 steering committee, it is my honor to welcome you all to the second edition of the Design and Verification Conference in Taiwan. The 1st DVCon has been held successfully in 2023. DVCon Taiwan 2024 will be held at Amazing Hall, with RISC-V Taipei Day on September …
Improving Commercial, Software Defined Vehicles COMVEC™ returns to Schaumburg, IL, in 2024! We are in the fast lane, driving toward a software-defined future. The commercial vehicle industry must come together to exchange ideas, get up to date on research and technology, and tackle challenges — so the world can continue to depend on us. SAE International’s COMVEC™ …
Whether you are a systems engineer, product manager, or technical professional, this panel will provide valuable knowledge and insights to garner the power of MBSE in your organization. Join us for an engaging and informative session as we delve into the future of systems engineering through the lens of MBSE. TIME: September 10, 2024 9 …
Continue reading "Webinar: Navigating the Details of MBSE: A Technical Panel Discussion II"
