Hot Chips 2024 will be held as a hybrid conference with in-person attendance at Memorial Auditorium, Stanford University from August 25 to 27, 2024. Conference Format Hot Chips 2024 is a hybrid conference. You may register to attend Virtually or In-Person. The In-Person conference is held at Memorial Auditorium, Stanford University. Tutorials: Sunday, August 25 …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
Share Your Story Are you driving design change? Do you think you have successfully overcome challenges that could impact the electronics revolution? CadenceLIVE is here to share your story. Come …
Focused on the dynamic world of Photonic Integrated Circuits (PICs) manufacturing, packaging, and testing. imec Philippe Soussan, Strategic Development Director will give a presentation About Join the online industry meeting focused …
Continue reading "Optica Online Industry Meeting: PIC Manufacturing, Packaging and Testing"
Description The expo has expanded since 2009, over the past 12 years. Its influence is widespread. In 2019, the event attracted 450 exhibitors and over 50,000 visitors. Visitors from 20 countries including China, Australia, and Canada came. Other countries represented were Egypt, France, Germany, and India. Iran, Italy, Japan, Korea, and Malaysia were also among …
Join us and discover how Autodesk Fusion and Ansys are transforming how consumer products are designed, putting you at the forefront of innovation and giving your creations the competitive edge they deserve. TIME: August 28, 2024 12 PM EDT / 9 AM PT Venue: Virtual Overview Imagine designing the next generation of consumer electronics, smart …
Continue reading "Webinar: Smart Product Innovation Just Got Easier"
The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated circuits. This conference will have highly technical content, focusing on the practical aspects of design and verification techniques and their use in cutting-edge projects. The …
About GlobalFoundries Technology Summit (GTS) GF Technology Summit (GTS) 2024 is our worldwide, annual series of technology-focused events. GTS brings together leaders from across the semiconductor industry to share their insights on the latest technology trends that enable us to design the essential chips the world relies on to live, work, and connect. GTS 2024 Highlights This …
Continue reading "GlobalFoundries Technology Summit (GTS) North America 2024"
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These …
On behalf of the Local Organising Committee and the International Scientific Committee we are pleased to be hosting the next iteration of the successful conference series in Edinburgh. Edinburgh Skyline from Calton Hill on …
The Premier Microelectronics Event This year, SEMICON Taiwan has achieved a record scale with more than 1,000 exhibitors across 3,600 booths. Themed 'Breaking Limits: Powering the AI Era', the event …
Join us in this webinar to learn about the new features available in Ansys Fluent in 2024 R2. Time: September 3, 2024 11am EST Venue: Virtual What attendees will learn …
