Share your research and join the outstanding program for 2024 Make plans to join the premier worldwide technical meeting for photomasks, patterning, metrology, materials, inspection/repair, mask business, extreme UV lithography, …
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MATERIALS REVOLUTION: Shaping the Future of Electronics & Beyond, and the Impact of AI The Strategic Materials Conference—SMC attracts an influential audience from every segment of the semiconductor manufacturing industry. Get …
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Our Jam-Packed Annual Symposium The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of …
Join our webinar to discover how the new Ansys HFSS-IC can revolutionize the simulation of complex interposers and 3DIC systems, improving design cycles and product performance for advanced packaging teams. …
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Virtual Event Oct 1st, 2024 | 8:00 AM PDT Oct 2nd, 2024 | 8:00 AM GMT+8 Memory Users Conference Advancements in memory technology are fueling rapid growth in big data …
About Rambus Design Summit Generative AI is poised to revolutionize every industry and redefine our daily lives. Realizing its full potential requires a dedicated-infrastructure spanning the latest in memory solutions …
This year's event is packed with industry-leading speakers, a top plenary and industry-focused sessions, and a dedicated Ansys LS-DYNA track. Join us to uncover what's possible through simulation. Hear from leading industry speakers showcasing their use of Ansys simulation. Gain insight into Ansys' simulation strategy covering Sustainability, AI/ML, Digital Engineering and more. Join one of …
Edge Computing Expo arrives at the RAI, Amsterdam on 1-2 October 2024! Grab your ticket today to hear from leading experts as they explore how edge computing can enable a significant increase in operational efficiency and automation, while dramatically reducing latency in your business. Register today to access a variety of specialist sessions to boost …
Book your conference ticket to Digital Transformation Week Europe which is set to explore what’s new and worth attention in the Digital Transformation ecosystem. Learn more: https://digitaltransformation-week.com/europe/ Join us in-person at the RAI, Amsterdam on 1-2 October 2024 to hear from over 200 inspiring industry leading speakers. Key topics explored: • Learn what’s new and worth …
ME-Pro™ is a unified tool for designers, process developers, modeling engineers, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. This comprehensive platform supports evaluation across device, circuit, and process domains enabling interactive development and offering critical feedback for process improvements. With decades of Primarius’ expertise, ME-Pro™ features …
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EDPS 2024 is now taking shape. The place to be is once again SEMI, in Milpitas, and the dates are Thursday and Friday, Oct 3rd and 4th, 2024. Registration is …
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We will introduce all the physics and system design that simulation can support when designing wind turbines. Learn how to engage students in engineering and design challenges and enhance their understanding of industrial aerodynamics, specifically wind engineering. TIME: October 3, 2024 11:00 AM EDT Venue: Virtual Overview Wind energy is one of the best sectors …
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One of the main draws of digital engineering to enable true digital transformation is using connected digital models to provide timely contextual engineering insight for decision-making. The new 2024 R2 …
The 2024 Leaders in Simulation Summit Great ideas begin with people like you. Having the right solution at the right time can mean the difference between tabling thoughts or transforming industries. Ansys technologies puts the power of innovation in your hands. Step into the future of engineering at the Simulation Leaders Summit, where we celebrate …
Processor trace gives software developers access to critical insights and forensic capabilities to manage the risk of building embedded systems. In this presentation, Siemens and Lauterbach will give an overview of how processor trace can be used to improve embedded software and applications. We will explain the RISC-V Efficient Trace (E-trace) specification and cover the …
Employing innovative adaptive dual-solver technology, NanoSpice Pro X™ integrates the cutting-edge FastSPICE engine with the analog engine to deliver high accuracy and performance for memory circuits, CPUs, custom digital designs, SoCs, and full-chip mixed-signal applications. Featuring breakthrough capabilities like intelligent topology recognition, automated partitioning, and enhanced event-driven architecture. NanoSpice Pro X™ excels in RC reduction …
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This Ansys-hosted event focuses on the transformative impact of artificial intelligence and advanced engineering methods on the region's industries. Attendees will learn about our cutting-edge AI technologies, innovative engineering practices, and how AI will shape the future of industry/engineering. Date: Thursday, October 10, 2024 Time: 9:30 AM – 3:30 PM ET (HH 4:00 PM – 6:00 PM) Venue: 850 …
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The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application of languages, tools and intellectual property for the design and verification of electronic …
From Ideas to Impact The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software. The 2024 OCP Global Summit theme is "From …
Last year the 70 year-old Tokyo Motor Show was reborn as the Japan Mobility Show, conceived to promote collaboration across industries through new partnerships working to create the mobility of the future. To further this vision, this year’s show—held in collaboration and concurrently with CEATEC 2024, Japan’s largest digital exhibition of its IT and electronic …
Join Keysight for a comprehensive session focused on enhancing device reliability and preventing costly silicon respins through innovative noise and binning modeling technologies. Enhancing Reliability with Accurate Noise Measurement and Modeling Accurately accounting for noise is essential for ensuring reliability of complex semiconductor devices. Explore how noise data across the wafer serves as an early …
SDEP™ provides robust APIs for creating automated reusable modeling flows significantly reducing turnaround time while preserving essential device modeling knowledge. The platform integrates Primarius‘ latest technologies for data analysis, parameter extraction, and model quality checking. With its flexible GUI and flow control capabilities, SDEP™ enables modeling engineers to efficiently build and customize workflows, automate routine …
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Become part of a European network of engineers developing innovative approaches and solutions shaping the future. The Ansys Innovation Conference, Germany brings together the renowned LS-DYNA forum and Digital Safety Conference into a larger cross- functional event. It is free to attend offers leading keynotes, customer-led technical sessions on the first conference day and technical …
This Summit will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the west coast. The Packaging Chips with CHIPS: West Coast Summit is a one-day semi summit that will bring together leading thinkers from chip packaging and design companies, along with government policy makers, to discuss the chip packaging industry in …
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