Webinar: IC Packaging Technology
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and …
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IOTE Expo China 2024
Shenzhen World Exhibiton & Convention Center 福海街道展城路1号 邮政编码, Shenzhen, Guangdong Province, ChinaDescription The expo has expanded since 2009, over the past 12 years. Its influence is widespread. In 2019, the event attracted 450 exhibitors and over 50,000 visitors. Visitors from 20 countries including China, Australia, and Canada came. Other countries represented were Egypt, France, Germany, and India. Iran, Italy, Japan, Korea, and Malaysia were also among …
Webinar: Smart Product Innovation Just Got Easier
Join us and discover how Autodesk Fusion and Ansys are transforming how consumer products are designed, putting you at the forefront of innovation and giving your creations the competitive edge …
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DVCon Japan 2024
Shinagawa, Tokyo, Japan Shinagawa, Tokyo, JapanThe Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated circuits. This conference will have highly technical content, focusing on the practical aspects of design and verification techniques and their use in cutting-edge projects. The …
GlobalFoundries Technology Summit (GTS) North America 2024
Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United StatesAbout GlobalFoundries Technology Summit (GTS) GF Technology Summit (GTS) 2024 is our worldwide, annual series of technology-focused events. GTS brings together leaders from across the semiconductor industry to share their insights on the latest technology trends that enable us to design the essential chips the world relies on to live, work, and connect. GTS 2024 Highlights This …
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Advanced CMOS/FinFET Fabrication
SingaporeSemiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These …
CHoPS 2024 (11th International Conference on Conveying and Handling of Particulate Solids)
Edinburgh, Scotland Edinburgh, Scotland, United KingdomOn behalf of the Local Organising Committee and the International Scientific Committee we are pleased to be hosting the next iteration of the successful conference series in Edinburgh. Edinburgh Skyline from Calton Hill on …
SEMICON Taiwan 2024
Taipei, Taiwan Taipei, TaiwanThe Premier Microelectronics Event This year, SEMICON Taiwan has achieved a record scale with more than 1,000 exhibitors across 3,600 booths. Themed 'Breaking Limits: Powering the AI Era', the event …
Ansys 2024 R2: Ansys Fluent What’s New
Join us in this webinar to learn about the new features available in Ansys Fluent in 2024 R2. Time: September 3, 2024 11am EST Venue: Virtual What attendees will learn …
Ansys 2024 R2: Ansys Fluent GPU Solver What’s New
Check out the latest updates to Ansys Fluent GPU Solver in 2024 R2, including additional hardware support, new physics, and simulation environment improvements in this upcoming webinar. TIME: September 4, …
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Webinar: Transforming Physics Simulations with Ansys and Microsoft
Introducing Ansys Access on Microsoft Azure, a newly released option that streamlines your transition to the cloud. This solution allows a hybrid approach, enabling you to offload heavy workloads to …
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Ansys 2024 R2: Ansys Digital Twin What’s New
Ansys introduces Ansys TwinAI, a new addition to Ansys Digital Twin's product portfolio that seamlessly integrates the accuracy of physics models with insights from real-world data powered by cutting-edge AI/ML techniques in this upcoming webinar. TIME: September 5, 2024 Venue: Virtual Overview Ansys launched Ansys 2024 R2, which extends its digital twin offering in multiple …
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Webinar: Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation
Join this webinar for the latest updates on virtual engineering simulation capabilities in the primary and secondary packaging domain. Showcasing physics-based 3D simulation for performance insight during storage, transportation, and manufacture. Date: Thursday, September 5, 2024 Time: 15:00 BST, 16:00 CEST, 10:00 EDT Venue: Online Questions Should you have any questions please contact uk-marketing@ansys.com About this …
Synopsys Processor IP Summit 2024
Santa Clara Marriott Santa Clara, CA, United StatesPower-Efficient RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the …
Webinar: ISO26262 FuSa Software Hands-On Workshop for Automotive Value Chain
We are holding a FREE virtual workshop course for automotive OEM, suppliers and semiconductor industry professionals who want to better understand the software solutions available to help them comply with ISO26262 when going from chip to vehicle system. TIME: SEPTEMBER 5, 2024 9:30 AM – 4:30 PM CET Venue: Virtual Overview This course will combine lectures …
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