Explore the latest advancements in Ansys Sherlock and Electronics Reliability in the 2024 R2 release. This latest update enhances electronics reliability with key features that help users save time, improve accuracy, and refine reliability prediction results. TIME: September 19, 2024 11 AM EST Venue: Virtual Overview Explore the latest Ansys Sherlock and Electronics Reliability advancements …
Join Ansys on Thursday, September 19, for our second annual Waltham User Forum. This one-day event combines expert-led discussions on trending AI topics with technical sessions on new features in Ansys multiphysics offerings. New for 2024 is our Demo Pavilion, which showcases live simulation demonstrations led by our technical experts. Date: Thursday, September 19, 2024 Time: 9:30 …
Abstract: A successful multi-die design begins at the architecture exploration level. However, the architecture challenges are exacerbated for multi-die designs as performance and power need to be optimized across multiple heterogeneous and homogeneous dies. Disaggregating IPs based on workload demands, selecting the right interface, and accurately predicting power and performance indicators are among some of …
Join Ansys Optics Manager of Product Management, Tom Pickering, and Senior Manager of Optical Assemblies and Technology, Katie Schwertz, for a comprehensive webinar on the design process for optical assemblies, focusing on requirements development, feasibility studies, preliminary, and critical design stages. TIME: September 20, 2024 Session ONE: 9:00 am EDT Session TWO: 2:00 pm EDT …
About The European Microwave Association (EuMA) is an international non-profit association with a scientific, educational and technical purpose. The aim of the Association is to develop in an interdisciplinary way, …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating …
ECOC Exhibition 2024 travels to Frankfurt in Germany. Meet with more than 300 companies and over 6000 colleagues, peers and contacts over the three days. Find out what you can expect at ECOC Exhibition 2024 and read the highlights from the 2023 event which took place in Glasgow in October MARKET FOCUS Now in it’s …
Join us for a 2-day deep dive into the expanding world of Digital Twin (DT) technology in the semiconductor realm. Understand its potential challenges and opportunities and discover its transformative …
We will discuss the findings of a joint survey conducted by Hyperion Research, Intel, and Ansys on Total Cost of Ownership (TCO) models utilized for both on-premises and cloud-based HPC resources during this upcoming webinar. TIME: September 24, 2024 11:00 AM EDT Venue: Virtual Overview In this webinar, we will discuss the findings of a …
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Primarius NanoSpice™ Series boosts SRAM design accuracy and performance with its powerful suite of tools. Featuring competitive performance, a circuit-type-driven intuitive usage model, and comprehensive capabilities. These solutions deliver high-precision simulations for SRAM blocks, critical paths, and full macro cases covering timing, constraints, and power. Equipped with SPICE and Fast SPICE engines, the solutions effectively …
September 17 and 24, 2024, 15:00 - 16:00 (CEST) | Join the webinar live or watch it later on demand Join our engaging webinar series on blue GIS technology, tailored for professionals eager to understand the intersection of technology and sustainable energy systems. Dive into the fundamentals and advanced features of blue GIS, including its …
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In this webinar, we'll showcase how advanced engineering analytics and materials intelligence can optimize your design processes for sustainability. Discover how to enhance product development by reducing environmental impacts and …
WELCOME TO SISPAD2024 The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development in the area of …
Join us for an informative webinar on Simulation Process and Data Management (SPDM), to learn how Ansys Minerva effectively manages simulation parameters and standardizes use amongst the simulation users within …
*registration subject to approval Join us to discuss the future of battery technology innovation. In collaboration with the UK Battery Industrialization Centre (UKBIC), this event offers a unique opportunity to …
Electromagnetic immunity (EMI) testing is a crucial part of designing any component exposed to electromagnetic disturbance, as it helps avoid issues later in the product development cycle. This webinar will …
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Sign up for this webinar to learn how superior multiphysics simulation requires the right infrastructure. We explore some building blocks behind a connected, accurate, and repeatable multiphysics workflow that can …
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THE JOURNEY TO A $1T GLOBAL INDUSTRY The GSA US Executive Forum will delve into the semiconductor industry’s journey toward achieving the trillion-dollar milestone. The industry operates in a complex …
Share your research and join the outstanding program for 2024 Make plans to join the premier worldwide technical meeting for photomasks, patterning, metrology, materials, inspection/repair, mask business, extreme UV lithography, …
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MATERIALS REVOLUTION: Shaping the Future of Electronics & Beyond, and the Impact of AI The Strategic Materials Conference—SMC attracts an influential audience from every segment of the semiconductor manufacturing industry. Get …
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Our Jam-Packed Annual Symposium The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of …
Join our webinar to discover how the new Ansys HFSS-IC can revolutionize the simulation of complex interposers and 3DIC systems, improving design cycles and product performance for advanced packaging teams. TIME: October 1, 2024 SESSION ONE: 11 AM EDT / 5 PM CEST / 8: 30 PM IST SESSION TWO: 8 PM EDT / 2 …
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Virtual Event Oct 1st, 2024 | 8:00 AM PDT Oct 2nd, 2024 | 8:00 AM GMT+8 Memory Users Conference Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest technology …
About Rambus Design Summit Generative AI is poised to revolutionize every industry and redefine our daily lives. Realizing its full potential requires a dedicated-infrastructure spanning the latest in memory solutions …
This year's event is packed with industry-leading speakers, a top plenary and industry-focused sessions, and a dedicated Ansys LS-DYNA track. Join us to uncover what's possible through simulation. Hear from leading industry speakers showcasing their use of Ansys simulation. Gain insight into Ansys' simulation strategy covering Sustainability, AI/ML, Digital Engineering and more. Join one of …
Edge Computing Expo arrives at the RAI, Amsterdam on 1-2 October 2024! Grab your ticket today to hear from leading experts as they explore how edge computing can enable a …
Book your conference ticket to Digital Transformation Week Europe which is set to explore what’s new and worth attention in the Digital Transformation ecosystem. Learn more: https://digitaltransformation-week.com/europe/ Join us in-person …
ME-Pro™ is a unified tool for designers, process developers, modeling engineers, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. This comprehensive platform supports evaluation across device, circuit, and process domains enabling interactive development and offering critical feedback for process improvements. With decades of Primarius’ expertise, ME-Pro™ features …
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EDPS 2024 is now taking shape. The place to be is once again SEMI, in Milpitas, and the dates are Thursday and Friday, Oct 3rd and 4th, 2024. Registration is …
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We will introduce all the physics and system design that simulation can support when designing wind turbines. Learn how to engage students in engineering and design challenges and enhance their …
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One of the main draws of digital engineering to enable true digital transformation is using connected digital models to provide timely contextual engineering insight for decision-making. The new 2024 R2 versions of Ansys Minerva, ModelCenter, and STK take the idea of connectedness to the next level. These new features will enable Ansys ModelCenter and STK …
The 2024 Leaders in Simulation Summit Great ideas begin with people like you. Having the right solution at the right time can mean the difference between tabling thoughts or transforming …
Processor trace gives software developers access to critical insights and forensic capabilities to manage the risk of building embedded systems. In this presentation, Siemens and Lauterbach will give an overview …
Employing innovative adaptive dual-solver technology, NanoSpice Pro X™ integrates the cutting-edge FastSPICE engine with the analog engine to deliver high accuracy and performance for memory circuits, CPUs, custom digital designs, …
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This Ansys-hosted event focuses on the transformative impact of artificial intelligence and advanced engineering methods on the region's industries. Attendees will learn about our cutting-edge AI technologies, innovative engineering practices, …
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The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application of languages, tools and intellectual property for the design and verification of electronic …
From Ideas to Impact The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from …
Last year the 70 year-old Tokyo Motor Show was reborn as the Japan Mobility Show, conceived to promote collaboration across industries through new partnerships working to create the mobility of …
Join Keysight for a comprehensive session focused on enhancing device reliability and preventing costly silicon respins through innovative noise and binning modeling technologies. Enhancing Reliability with Accurate Noise Measurement and …
SDEP™ provides robust APIs for creating automated reusable modeling flows significantly reducing turnaround time while preserving essential device modeling knowledge. The platform integrates Primarius‘ latest technologies for data analysis, parameter extraction, and model quality checking. With its flexible GUI and flow control capabilities, SDEP™ enables modeling engineers to efficiently build and customize workflows, automate routine …
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Become part of a European network of engineers developing innovative approaches and solutions shaping the future. The Ansys Innovation Conference, Germany brings together the renowned LS-DYNA forum and Digital Safety Conference into a larger cross- functional event. It is free to attend offers leading keynotes, customer-led technical sessions on the first conference day and technical …
This Summit will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the west coast. The Packaging Chips with CHIPS: West Coast Summit is a one-day semi …
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The 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 at 𝗠𝗮𝗱𝗿𝗶𝗱 is an exclusive event where every engineer, researcher or scientist who uses or is interested in numerical simulation will find a unique experience focused on …
Discover the Future of HyperLynx Technology: Lunch and Learn Join us to be among the first to explore HyperLynx breakthrough technologies designed to redefine user experience and boost design productivity. Released in September 2024, these innovations are tailored to address the most pressing challenges faced by design engineers, helping you stay ahead in a competitive …
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