Don’t miss the latest innovations for the Ansys Safety Analysis platform for Ansys 2024 R2. We’ve included a collaboration solution that enables seamless teamwork and serves our new web-based Digital Safety Manager (DSM). TIME: September 18, 2024 11:00 AM - 12:00 PM (EDT) Venue: Virtual Overview This webinar provides insights on the latest Ansys Safety …
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About GlobalFoundries Technology Summit (GTS) GF Technology Summit (GTS) 2024 is GF's worldwide, annual series of in-person, technology-focused events. GTS brings together leaders from the commercial, business and research worlds to understand the latest technology challenges and opportunities, and partner to create the most innovative applications and solutions. GTS 2024 Highlights This year's GTS will focus on how …
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Wednesday, September 18, 2024 | 10 a.m. PDT Migrating analog designs across process nodes can be a complex and time-consuming challenge. In this webinar, Credo will share its experience using Synopsys ASO.ai, part of the Synopsys.ai™ EDA suite, to streamline and accelerate the design migration of analog circuits. With its automated schematic migration feature, Synopsys …
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Join this webinar to learn about the latest digital twin product, Ansys TwinAI. This solution integrates the accuracy of physics models with insights from real-world data powered by AI/ML techniques. SESSION ONE: 5:30 AM EDT / 11:30 AM CEST / 3 PM IST Register Now SESSION TWO: 11 AM EDT / 5 PM CEST / …
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Explore the latest advancements in Ansys Sherlock and Electronics Reliability in the 2024 R2 release. This latest update enhances electronics reliability with key features that help users save time, improve accuracy, and refine reliability prediction results. TIME: September 19, 2024 11 AM EST Venue: Virtual Overview Explore the latest Ansys Sherlock and Electronics Reliability advancements …
Join Ansys on Thursday, September 19, for our second annual Waltham User Forum. This one-day event combines expert-led discussions on trending AI topics with technical sessions on new features in Ansys multiphysics offerings. New for 2024 is our Demo Pavilion, which showcases live simulation demonstrations led by our technical experts. Date: Thursday, September 19, 2024 Time: 9:30 …
Abstract: A successful multi-die design begins at the architecture exploration level. However, the architecture challenges are exacerbated for multi-die designs as performance and power need to be optimized across multiple heterogeneous and homogeneous dies. Disaggregating IPs based on workload demands, selecting the right interface, and accurately predicting power and performance indicators are among some of …
Join Ansys Optics Manager of Product Management, Tom Pickering, and Senior Manager of Optical Assemblies and Technology, Katie Schwertz, for a comprehensive webinar on the design process for optical assemblies, focusing on requirements development, feasibility studies, preliminary, and critical design stages. TIME: September 20, 2024 Session ONE: 9:00 am EDT Session TWO: 2:00 pm EDT …
About The European Microwave Association (EuMA) is an international non-profit association with a scientific, educational and technical purpose. The aim of the Association is to develop in an interdisciplinary way, education, training and research activities, including: Promoting European microwaves Networking and uniting microwave scientists and engineers in Europe Providing a single voice for European microwave …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
ECOC Exhibition 2024 travels to Frankfurt in Germany. Meet with more than 300 companies and over 6000 colleagues, peers and contacts over the three days. Find out what you can expect at ECOC Exhibition 2024 and read the highlights from the 2023 event which took place in Glasgow in October MARKET FOCUS Now in it’s …
Join us for a 2-day deep dive into the expanding world of Digital Twin (DT) technology in the semiconductor realm. Understand its potential challenges and opportunities and discover its transformative …
We will discuss the findings of a joint survey conducted by Hyperion Research, Intel, and Ansys on Total Cost of Ownership (TCO) models utilized for both on-premises and cloud-based HPC …
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Primarius NanoSpice™ Series boosts SRAM design accuracy and performance with its powerful suite of tools. Featuring competitive performance, a circuit-type-driven intuitive usage model, and comprehensive capabilities. These solutions deliver high-precision …
September 17 and 24, 2024, 15:00 - 16:00 (CEST) | Join the webinar live or watch it later on demand Join our engaging webinar series on blue GIS technology, tailored for professionals eager to understand the intersection of technology and sustainable energy systems. Dive into the fundamentals and advanced features of blue GIS, including its …
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In this webinar, we'll showcase how advanced engineering analytics and materials intelligence can optimize your design processes for sustainability. Discover how to enhance product development by reducing environmental impacts and achieving regulatory compliance. TIME: September 24, 2024 4 PM CEST Venue: Virtual Overview In this webinar, we will showcase how advanced engineering analytics and materials …
WELCOME TO SISPAD2024 The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and …
Join us for an informative webinar on Simulation Process and Data Management (SPDM), to learn how Ansys Minerva effectively manages simulation parameters and standardizes use amongst the simulation users within an organisation. Investigate how you can seamlessly integrate verification plans into simulation workflows and generate reports configured to specific criteria. TIME: September 25, 2024 11 …
*registration subject to approval Join us to discuss the future of battery technology innovation. In collaboration with the UK Battery Industrialization Centre (UKBIC), this event offers a unique opportunity to gain insight into battery development and a deeper understanding of the critical role simulation plays in battery manufacturing, management, and system integration. Date: Thursday, September …
Electromagnetic immunity (EMI) testing is a crucial part of designing any component exposed to electromagnetic disturbance, as it helps avoid issues later in the product development cycle. This webinar will show how CNH Industrial uses EMI simulation to solve sound reception issues. TIME: September 26, 2024 10 AM EDT / 4 PM CEST / 7:30 …
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Sign up for this webinar to learn how superior multiphysics simulation requires the right infrastructure. We explore some building blocks behind a connected, accurate, and repeatable multiphysics workflow that can be used across your business. TIME: September 26, 2024 11 AM EDT Venue: Virtual Overview Having the correct physics solvers is one thing. Building these …
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THE JOURNEY TO A $1T GLOBAL INDUSTRY The GSA US Executive Forum will delve into the semiconductor industry’s journey toward achieving the trillion-dollar milestone. The industry operates in a complex environment where global forces intersect with regional dynamics. Industry executives will explore the delicate balance between globalization and regionalization, considering both opportunities and challenges while …
Share your research and join the outstanding program for 2024 Make plans to join the premier worldwide technical meeting for photomasks, patterning, metrology, materials, inspection/repair, mask business, extreme UV lithography, and emerging technologies. Present your research in Monterey. Present your research in Monterey, 29 September - 3 October 2024. The call for papers is open. …
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MATERIALS REVOLUTION: Shaping the Future of Electronics & Beyond, and the Impact of AI The Strategic Materials Conference—SMC attracts an influential audience from every segment of the semiconductor manufacturing industry. Get insights on current developments in advanced materials. SMC is a valuable, productive blend of learning, and networking with industry leaders, experts, and colleagues. Hear the …
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Our Jam-Packed Annual Symposium The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors …
Join our webinar to discover how the new Ansys HFSS-IC can revolutionize the simulation of complex interposers and 3DIC systems, improving design cycles and product performance for advanced packaging teams. TIME: October 1, 2024 SESSION ONE: 11 AM EDT / 5 PM CEST / 8: 30 PM IST SESSION TWO: 8 PM EDT / 2 …
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Virtual Event Oct 1st, 2024 | 8:00 AM PDT Oct 2nd, 2024 | 8:00 AM GMT+8 Memory Users Conference Advancements in memory technology are fueling rapid growth in big data …
About Rambus Design Summit Generative AI is poised to revolutionize every industry and redefine our daily lives. Realizing its full potential requires a dedicated-infrastructure spanning the latest in memory solutions …
This year's event is packed with industry-leading speakers, a top plenary and industry-focused sessions, and a dedicated Ansys LS-DYNA track. Join us to uncover what's possible through simulation. Hear from …
Edge Computing Expo arrives at the RAI, Amsterdam on 1-2 October 2024! Grab your ticket today to hear from leading experts as they explore how edge computing can enable a …
Book your conference ticket to Digital Transformation Week Europe which is set to explore what’s new and worth attention in the Digital Transformation ecosystem. Learn more: https://digitaltransformation-week.com/europe/ Join us in-person …
ME-Pro™ is a unified tool for designers, process developers, modeling engineers, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. This comprehensive platform supports evaluation across device, circuit, and process domains enabling interactive development and offering critical feedback for process improvements. With decades of Primarius’ expertise, ME-Pro™ features …
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EDPS 2024 is now taking shape. The place to be is once again SEMI, in Milpitas, and the dates are Thursday and Friday, Oct 3rd and 4th, 2024. Registration is …
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We will introduce all the physics and system design that simulation can support when designing wind turbines. Learn how to engage students in engineering and design challenges and enhance their understanding of industrial aerodynamics, specifically wind engineering. TIME: October 3, 2024 11:00 AM EDT Venue: Virtual Overview Wind energy is one of the best sectors …
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One of the main draws of digital engineering to enable true digital transformation is using connected digital models to provide timely contextual engineering insight for decision-making. The new 2024 R2 versions of Ansys Minerva, ModelCenter, and STK take the idea of connectedness to the next level. These new features will enable Ansys ModelCenter and STK …
The 2024 Leaders in Simulation Summit Great ideas begin with people like you. Having the right solution at the right time can mean the difference between tabling thoughts or transforming …
Processor trace gives software developers access to critical insights and forensic capabilities to manage the risk of building embedded systems. In this presentation, Siemens and Lauterbach will give an overview of how processor trace can be used to improve embedded software and applications. We will explain the RISC-V Efficient Trace (E-trace) specification and cover the …
Employing innovative adaptive dual-solver technology, NanoSpice Pro X™ integrates the cutting-edge FastSPICE engine with the analog engine to deliver high accuracy and performance for memory circuits, CPUs, custom digital designs, SoCs, and full-chip mixed-signal applications. Featuring breakthrough capabilities like intelligent topology recognition, automated partitioning, and enhanced event-driven architecture. NanoSpice Pro X™ excels in RC reduction …
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This Ansys-hosted event focuses on the transformative impact of artificial intelligence and advanced engineering methods on the region's industries. Attendees will learn about our cutting-edge AI technologies, innovative engineering practices, …
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