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Webinar: Multiphysics Simulation of Challenges in 3D IC and Chiplet Designs
June 18
Multiple Sessions – All English Language:
14:00 JST (APAC)
10:00 EDT, 16:00 CET (AMER and EUR)
Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics suites from Altair assist designers in optimizing thermal management strategies and minimizing thermal stress-induced failures as well solder fatigue analysis at early phases of the system design.
Why should you attend this webinar?
This webinar will demonstrate how 3D IC designers can meet the accelerating demands for semiconductor designs requiring higher performance, lower power consumption, and efficient space utilisation.
We will address the following challenges during the webinar:
- Modelling for chiplets, packages, boards, and systems to ensure safe thermal behaviour, structural reliability, and solder fatigue analysis.
- Ensure optimal thermal management due to the increased packing density and reduced thermal dissipation area.
- Co-design heterogeneous components while ensuring compatibility and performance.
- Extraction of package interconnect parasitics at low frequencies with quasi static solver using PEEC method
Next Generation of Systems Design at Siemens