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Webinar: Mastering 3D-IC Design Challenges Through Advanced Simulation
October 1
Join our webinar to discover how the new Ansys HFSS-IC can revolutionize the simulation of complex interposers and 3DIC systems, improving design cycles and product performance for advanced packaging teams.
TIME:
October 1, 2024
SESSION ONE: 11 AM EDT / 5 PM CEST / 8: 30 PM IST
SESSION TWO: 8 PM EDT / 2 AM CEST (+1 day) / 5:30 AM IST (+1 day)
Venue:
Virtual
Overview
One of the biggest challenges faced by 3D-IC and advanced packaging teams today is the accurate and efficient simulation of complex interposers and 3D-IC systems, which can significantly impact design cycles and product performance. Ansys HFSS-IC offers new and enhanced technologies that provide greater capacity and performance for the simulation of interposer and 3D-IC.
In this webinar, we will present the latest workflows and simulation technologies enabling engineering teams developing interposers and 3DIC systems to leverage the speed and accuracy of HFSS.
Learning Outcomes
- What is HFSS-IC?
- Key simulation settings for interposer extraction
- Stacked die, interposer, and package – how to model the full assembly
Who Should Attend
Advanced packaging engineers who are interested in learning best practices for interposer extraction and system assembly modeling.
Speakers
- Sara Louie, Principal Product Manager
- Tom MacDonald, Principal Application Engineer
Next Generation of Systems Design at Siemens