Webinar: Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation

Join this webinar for the latest updates on virtual engineering simulation capabilities in the primary and secondary packaging domain. Showcasing physics-based 3D simulation for performance insight during storage, transportation, and manufacture.

Date:
Thursday, September 5, 2024

Time:
15:00 BST, 16:00 CEST, 10:00 EDT

Venue:
Online

Questions
Should you have any questions please contact uk-marketing@ansys.com

About this webinar

Digital engineering is ramping up across the CPG, healthcare and wider packaging sector. Packaging engineers are tasked with producing fit-for-purpose packaging that is optimised for customer-use, transportation, storage and for production-line filling/handling. In addition, manufacturing the packaging containers as optimally as possible to avoid defects is vitally important. All in the landscape of sustainability.

Ansys provides leading physics-based 3D simulation tools applicable to a wide range of scenarios from filling of liquids and solids, drop-testing, thermal management, vibration under transportation, top-load strength testing, conveying, package crimping, blow moulding, thermoforming, heat-sealing and board-creasing.

Join this webinar to be updated on the latest virtual engineering simulation capabilities from Ansys in the packaging domain.

What you will learn

• The use of physics-based 3D simulation to gain engineering insight into the performance of packaging whilst in the hands of an end-user, in storage, under transportation and during manufacture.
• The state of the art from an Ansys perspective on the use of digital engineering to drive innovation, efficiency and sustainability in the packaging sector.
• The use of Ansys Granta Selector software for smarter material selection

Who should attend

• Packaging engineers and designers interested in the use of simulation in the packaging industry.
• Material scientists involved in the selection of materials for packaging.
• Current users of CFD, Discrete Element Modelling, structural and thermal simulation FEA tools in the packaging domain.

Speakers

• Mikael Schill, Senior Manager and Application Engineering, Ansys
• Marcus Redhe, Director Application Engineering, Ansys